Akagawa; Masatoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akagawa; Masatoshi.The latest application filed is for "wiring forming system and wiring forming method for forming wiring on wiring board".

Company Profile

0.25.23

Akagawa; Masatoshi - Nagano-shi JP
Akagawa; Masatoshi - Nagano JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring forming system and wiring forming method for forming wiring on wiring board App 20110106287 - Akagawa; Masatoshi ; et al.	2011-05-05
Wiring forming system and wiring forming method for forming wiring on wiring board Grant 7,890,203 - Akagawa , et al. February 15, 2	2011-02-15
Component-embedded board fabrication method Grant 7,793,412 - Akagawa , et al. September 14, 2	2010-09-14
Component-embedded circuit board fabrication method Grant 7,707,713 - Akagawa , et al. May 4, 2	2010-05-04
Patterning method and computer readable medium therefor Grant 7,495,745 - Yoshizawa , et al. February 24, 2	2009-02-24
Method of manufacturing radiating plate and semiconductor apparatus using the same Grant 7,445,965 - Akagawa , et al. November 4, 2	2008-11-04
Exposing apparatus and exposing method, for maskless exposure of substrate to be exposed, and plotter and plotting method for directly plotting on object to be plotted Grant 7,442,477 - Sekigawa , et al. October 28, 2	2008-10-28
Patterning method and computer readable medium therefor App 20080123070 - Yoshizawa; Keiji ; et al.	2008-05-29
Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board App 20080110021 - Akagawa; Masatoshi ; et al.	2008-05-15
Maskless direct exposure system and user interface Grant 7,307,691 - Sekigawa , et al. December 11, 2	2007-12-11
Pattern drawing apparatus and pattern drawing method for forming patterns, that have mirror image relationship to each other with respect to a substrate, on both sides of the substrate, and test apparatus for use in the pattern drawing apparatus Grant 7,303,243 - Akagawa , et al. December 4, 2	2007-12-04
Exposure method and device for forming patterns on printed wiring board Grant 7,179,584 - Sekigawa , et al. February 20, 2	2007-02-20
Billing apparatus for direct drawing apparatus App 20060253295 - Sekigawa; Kazunari ; et al.	2006-11-09
Method of mounting an electronic part Grant 7,100,279 - Suga , et al. September 5, 2	2006-09-05
Semiconductor device and manufacturing method therefor Grant 7,053,475 - Akagawa May 30, 2	2006-05-30
Method for manufacturing semiconductor device Grant 6,964,887 - Akagawa November 15, 2	2005-11-15
Method of manufacturing radiating plate and semiconductor apparatus using the same App 20050221536 - Akagawa, Masatoshi ; et al.	2005-10-06
Direct exposure system and user interface App 20050094120 - Sekigawa, Kazunari ; et al.	2005-05-05
Method of mounting an electronic part App 20040211060 - Suga, Tadatomo ; et al.	2004-10-28
Exposing apparatus and exposing method, for maskless exposure of substrate to be exposed, and plotter and plotting method for directly plotting on object to be plotted App 20040197683 - Sekigawa, Kazunari ; et al.	2004-10-07
Pattern drawing apparatus and pattern drawing method for forming patterns, that have mirror image relationship to each other with respect to a substrate, on both sides of the substrate, and test apparatus for use in the pattern drawing apparatus App 20040179050 - Akagawa, Masatoshi ; et al.	2004-09-16
Stereolithographic shaping method and apparatus App 20040175450 - Yanagisawa, Kenji ; et al.	2004-09-09
Semiconductor device and manufacturing method therefor Grant 6,759,268 - Akagawa July 6, 2	2004-07-06
Non-contact type IC card and process for manufacturing-same Grant 6,717,249 - Akagawa April 6, 2	2004-04-06
Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board App 20040049912 - Akagawa, Masatoshi ; et al.	2004-03-18
Wiring forming system and wiring forming method for forming wiring on wiring board App 20030224266 - Akagawa, Masatoshi ; et al.	2003-12-04
Method for manufacturing semiconductor device App 20030209806 - Akagawa, Masatoshi	2003-11-13
Semiconductor device and manufacturing method therefor Grant 6,590,291 - Akagawa July 8, 2	2003-07-08
Exposure method and device for forming patterns on printed wiring board App 20030124463 - Sekigawa, Kazunari ; et al.	2003-07-03
Non-contact type IC card App 20030057536 - Akagawa, Masatoshi	2003-03-27
Non-contact type IC card and process for manufacturing-same App 20020190365 - Akagawa, Masatoshi	2002-12-19
Non-contact type IC card and process for manufacturing same Grant 6,469,371 - Akagawa October 22, 2	2002-10-22
Semiconductor device and manufacturing method therefor App 20020146859 - Akagawa, Masatoshi	2002-10-10
Stereolithographic shaping method and apparatus App 20020047229 - Yanagisawa, Kenji ; et al.	2002-04-25
Non-contact type IC card App 20020030255 - Akagawa, Masatoshi	2002-03-14
Semiconductor device and manufacturing method therefor App 20010010627 - Akagawa, Masatoshi	2001-08-02
Semiconductor device and manufacturing method therefor App 20010008794 - Akagawa, Masatoshi	2001-07-19
Non-contact type IC card and process for manufacturing same App 20010006118 - Akagawa, Masatoshi	2001-07-05
IC card and plane coil for IC card Grant 6,255,725 - Akagawa , et al. July 3, 2	2001-07-03
IC card and its frame Grant 6,252,777 - Ikeda , et al. June 26, 2	2001-06-26
Frame for IC card App 20010004136 - Ikeda, Takashi ; et al.	2001-06-21
Anisotropic conductive sheet and printed circuit board Grant 6,121,688 - Akagawa September 19, 2	2000-09-19
Process for making a chip sized semiconductor device Grant 5,960,308 - Akagawa , et al. September 28, 1	1999-09-28
Process for producing a semiconductor device using anisotropic conductive adhesive Grant 5,918,113 - Higashi , et al. June 29, 1	1999-06-29
Anisotropic conductive sheet and printed circuit board Grant 5,886,415 - Akagawa March 23, 1	1999-03-23
Semiconductor device having an element with circuit pattern thereon Grant 5,834,844 - Akagawa , et al. November 10, 1	1998-11-10
Chip sized semiconductor device Grant 5,677,576 - Akagawa October 14, 1	1997-10-14
Semiconductor-device package and semiconductor device Grant 5,404,273 - Akagawa April 4, 1	1995-04-04

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