Ajoian; Jack Patent Filings

Patent	Date
Printed Circuit Board (pcb) And Pcb Assembly Having An Encapsulating Mold Material On A Bottom Surface Thereof And Methods For Molding An Encapsulating Mold Material On A Bottom Surface Of A Pcb App 20180063951 - Kumbhat; Nitesh ; et al.	2018-03-01
Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB Grant 9,907,169 - Kumbhat , et al. February 27, 2	2018-02-27
Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards Grant 9,832,865 - Ajoian , et al. November 28, 2	2017-11-28
Methods And Devices For Providing Increased Routing Flexibility In Multi-layer Printed Circuit Boards App 20170311444 - Ajoian; Jack ; et al.	2017-10-26
Methods and devices for preventing overhangs in a finishing layer of metal formed on electrical contact surfaces when fabricating multi-layer printed circuit boards Grant 9,668,340 - Ajoian , et al. May 30, 2	2017-05-30
Electronic Module Having An Oxide Surface Finish As A Solder Mask, And Method Of Manufacturing Electronic Module Using Organic Solderability Preservative And Oxide Surface Finish Processes App 20160064252 - Ajoian; Jack	2016-03-03
Method of fabricating printed circuit board (PCB) substrate having a cavity Grant 9,085,826 - Ajoian July 21, 2	2015-07-21
Method Of Fabricating Printed Circuit Board (pcb) Substrate Having A Cavity App 20150090688 - Ajoian; Jack	2015-04-02

Patent

Date

Printed Circuit Board (pcb) And Pcb Assembly Having An Encapsulating Mold Material On A Bottom Surface Thereof And Methods For Molding An Encapsulating Mold Material On A Bottom Surface Of A Pcb
App 20180063951 - Kumbhat; Nitesh ; et al.

2018-03-01

Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB
Grant 9,907,169 - Kumbhat , et al. February 27, 2

2018-02-27

Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards
Grant 9,832,865 - Ajoian , et al. November 28, 2

2017-11-28

Methods And Devices For Providing Increased Routing Flexibility In Multi-layer Printed Circuit Boards
App 20170311444 - Ajoian; Jack ; et al.

2017-10-26

Methods and devices for preventing overhangs in a finishing layer of metal formed on electrical contact surfaces when fabricating multi-layer printed circuit boards
Grant 9,668,340 - Ajoian , et al. May 30, 2

2017-05-30

Electronic Module Having An Oxide Surface Finish As A Solder Mask, And Method Of Manufacturing Electronic Module Using Organic Solderability Preservative And Oxide Surface Finish Processes
App 20160064252 - Ajoian; Jack

2016-03-03

Method of fabricating printed circuit board (PCB) substrate having a cavity
Grant 9,085,826 - Ajoian July 21, 2

2015-07-21

Method Of Fabricating Printed Circuit Board (pcb) Substrate Having A Cavity
App 20150090688 - Ajoian; Jack

2015-04-02

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Ajoian; Jack

Patent Applications and Registrations