Ajima; Takashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ajima; Takashi.The latest application filed is for "semiconductor device having insulating layer including polyimide film".

Company Profile

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Ajima; Takashi - Kamakura JP
Ajima; Takashi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having insulating layer including polyimide film Grant 4,853,760 - Abe , et al. August 1, 1	1989-08-01
Semiconductor device with an improved bonding section Grant 4,636,832 - Abe , et al. January 13, 1	1987-01-13
Semiconductor device having a multilayer wiring structure using a polyimide resin Grant 4,618,878 - Aoyama , et al. October 21, 1	1986-10-21
Semiconductor device of multilayer wiring structure Grant 4,613,888 - Mase , et al. September 23, 1	1986-09-23
Method of manufacturing a semiconductor device Grant 4,560,642 - Yonezawa , et al. December 24, 1	1985-12-24
Method for forming metallization structure having flat surface on semiconductor substrate Grant 4,520,041 - Aoyama , et al. May 28, 1	1985-05-28
Method of manufacturing a semiconductor device using epitaxially regrown protrusion as an alignment marker Grant 4,479,830 - Koshino , et al. October 30, 1	1984-10-30
System for etching a metal film on a semiconductor wafer Grant 4,462,856 - Abe , et al. July 31, 1	1984-07-31
Method of making transistors by ion implantations, electron beam irradiation and thermal annealing Grant 4,415,372 - Koshino , et al. November 15, 1	1983-11-15
Method of manufacturing a semiconductor device using silicon carbide mask Grant 4,351,894 - Yonezawa , et al. September 28, 1	1982-09-28
Semiconductor device with thermally compensating SiO.sub.2 -silicate glass-SiC passivation layer Grant 4,224,636 - Yonezawa , et al. September 23, 1	1980-09-23
Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat Grant 4,161,743 - Yonezawa , et al. July 17, 1	1979-07-17
Method of producing semiconductor device Grant 4,123,564 - Ajima , et al. October 31, 1	1978-10-31

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