Aizawa; Teruki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Aizawa; Teruki.The latest application filed is for "thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same".
- Aizawa; Teruki - Utsunomiya JP
- Aizawa; Teruki - Utsunomiya-shi JP
- Aizawa, Teruki - Tochigi JP
- Aizawa; Teruki - Shimodate JP
| Patent | Date |
|---|---|
| Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin Grant 7,538,150 - Oohori , et al. May 26, 2 | 2009-05-26 |
| Method for producing benzoxazine resin Grant 7,041,772 - Aizawa , et al. May 9, 2 | 2006-05-09 |
| Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same App 20060008632 - Oohori; Kenichi ; et al. | 2006-01-12 |
| Method for producing benzoxazine resin App 20040138345 - Aizawa, Teruki ; et al. | 2004-07-15 |
| Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith App 20040076805 - Oohori, Kenichi ; et al. | 2004-04-22 |
| Thermosetting compounds, cured product thereof and method of preparing the thermosetting compound Grant 6,005,064 - Hirai , et al. December 21, 1 | 1999-12-21 |
| Thermosetting resin composition, cured product, prepreg, metal-clad laminate and wiring board Grant 5,945,222 - Nagase , et al. August 31, 1 | 1999-08-31 |
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