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name:-0.0050549507141113
name:-0.0014281272888184
Aizawa; Rie Patent Filings

Aizawa; Rie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Aizawa; Rie.The latest application filed is for "fuel assembly, core design method and fuel assembly design method of light-water reactor".

Company Profile
1.5.10
  • Aizawa; Rie - Yokohama JP
  • Aizawa; Rie - Kanagawa N/A JP
  • Aizawa; Rie - Tokyo JP
  • Aizawa; Rie - Yokohama-shi JP
  • Aizawa; Rie - Kanagawa-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Fuel assembly, core design method and fuel assembly design method of light-water reactor
Grant 10,943,703 - Wada , et al. March 9, 2
2021-03-09
Fuel Assembly, Core Design Method And Fuel Assembly Design Method Of Light-water Reactor
App 20180226160 - WADA; Satoshi ;   et al.
2018-08-09
Light Water Reactor Fuel Assembly, Light Water Reactor Core And Mox Fuel Assembly Production Method
App 20180090233 - HIRAIWA; Kouji ;   et al.
2018-03-29
Electromagnetic pump compensation power supply apparatus and electromagnetic pump system
Grant 9,397,544 - Fujishima , et al. July 19, 2
2016-07-19
Electromagnetic Pump Compensation Power Supply Apparatus And Electromagnetic Pump System
App 20140091746 - Fujishima; Yasushi ;   et al.
2014-04-03
Image forming system and image reading apparatus
Grant 8,199,375 - Saito , et al. June 12, 2
2012-06-12
Image Forming System And Image Reading Apparatus
App 20090303552 - Saito; Yasuhiro ;   et al.
2009-12-10
High Temperature Steam Electrolyzing Device
App 20090152106 - YAMAUCHI; Hiroyuki ;   et al.
2009-06-18
Electromagnetic flowmeter including electrodes and magnetic pole placed in proximity on one side of the outer wall
Grant 7,267,012 - Ara , et al. September 11, 2
2007-09-11
Electromagnetic flowmeter
App 20070034015 - Ara; Kuniaki ;   et al.
2007-02-15
Soldering machine
App 20060124692 - Aizawa; Rie ;   et al.
2006-06-15
Soldering machine
App 20040256436 - Aizawa, Rie ;   et al.
2004-12-23
Soldering machine
App 20030102352 - Aizawa, Rie ;   et al.
2003-06-05

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