AIT-MANI; Abdenacer

Patent Applications and Registrations

Patent applications and USPTO patent grants for AIT-MANI; Abdenacer.The latest application filed is for "method for manufacturing a structure".

Company Profile

1.7.7

AIT-MANI; Abdenacer - Grenoble Cedex 09 FR
Ait-Mani; Abdenacer - Saint-Egreve FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Manufacturing A Structure App 20220189910 - CAICEDO PANQUEVA; Nohora-Lizeth ; et al.	2022-06-16
Compensation of an arc curvature generated in a wafer Grant 10,483,188 - Ait-Mani , et al. Nov	2019-11-19
Compensation Of An Arc Curvature Generated In A Wafer App 20180366389 - AIT-MANI; Abdenacer ; et al.	2018-12-20
Method for obtaining a heterogeneous substrate for the production of semiconductors Grant 9,337,037 - Ait-Mani , et al. May 10, 2	2016-05-10
Method for producing photosensitive infrared detectors Grant 9,318,527 - Huet , et al. April 19, 2	2016-04-19
Method For Producing Photosensitive Infrared Detectors App 20150102447 - Huet; Stephanie ; et al.	2015-04-16
Method For Obtaining A Heterogeneous Substrate For The Production Of Semiconductors, And Corresponding Substrate App 20140306268 - Ait-Mani; Abdenacer ; et al.	2014-10-16
Method for thickness-calibrated bonding between at least two substrates Grant 8,404,075 - Ait-Mani March 26, 2	2013-03-26
Method For Thickness-calibrated Bonding Between At Least Two Substrates App 20110308724 - AIT-MANI; Abdenacer	2011-12-22
Tweezers with gripping elements mounted swivelling on branches Grant 7,938,469 - Ait-Mani May 10, 2	2011-05-10
Tweezers with gripping elements mounted swivelling on branches App 20100096871 - Ait-Mani; Abdenacer	2010-04-22
Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit Grant 7,645,686 - Fendler , et al. January 12, 2	2010-01-12
Method Of Bonding Chips On A Strained Substrate And Method Of Placing Under Strain A Semiconductor Reading Circuit App 20090075423 - Fendler; Manuel ; et al.	2009-03-19

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