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Patent applications and USPTO patent grants for Ai-Chie; Wang.The latest application filed is for "pre-encapsulated cavity interposer".
Patent | Date |
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Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages Grant 8,399,297 - Yean , et al. March 19, 2 | 2013-03-19 |
Pre-encapsulated Cavity Interposer App 20120034740 - Yean; Tay Wuu ;   et al. | 2012-02-09 |
Pre-encapsulated cavity interposer Grant 8,072,082 - Yean , et al. December 6, 2 | 2011-12-06 |
Pre-encapsulated Cavity Interposer App 20090267171 - Yean; Tay Wuu ;   et al. | 2009-10-29 |
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