Patent | Date |
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Preparation of poly-o-hydroxyamides and poly o-mercaptoamides Grant 5,973,202 - Sezi , et al. October 26, 1 | 1999-10-26 |
Preparation of poly-o-hydroxyamides and poly o-mercaptoamides Grant 5,922,825 - Sezi , et al. July 13, 1 | 1999-07-13 |
Preparation of poly-O-hydroxyamides and poly O-mercaptoamides Grant 5,807,969 - Sezi , et al. September 15, 1 | 1998-09-15 |
Preparation of poly-O-hydroxyamides and poly O-mercaptoamides Grant 5,783,654 - Sezi , et al. July 21, 1 | 1998-07-21 |
Preparation of poly-o-hydroxyamides and poly-o-mercaptoamides Grant 5,760,162 - Sezi , et al. June 2, 1 | 1998-06-02 |
Dry-developable positive resist Grant 5,733,706 - Sezi , et al. March 31, 1 | 1998-03-31 |
Preparation of poly-o-hydroxyamides and poly o-mercaptoamides Grant 5,726,279 - Sezi , et al. March 10, 1 | 1998-03-10 |
Mixed polymers Grant 5,703,186 - Sezi , et al. December 30, 1 | 1997-12-30 |
Production of photolithographic structures Grant 5,384,220 - Sezi , et al. January 24, 1 | 1995-01-24 |
Highly heat-resistant positive resists comprising end-capped hydroxypolyamides Grant 5,376,499 - Hammerschmidt , et al. December 27, 1 | 1994-12-27 |
Method for producing a resist structure Grant 5,262,283 - Sezi , et al. * November 16, 1 | 1993-11-16 |
Photostructuring process Grant 5,250,375 - Sebald , et al. October 5, 1 | 1993-10-05 |
Method for dimensionally accurate structure transfer in bilayer technique wherein a treating step with a bulging agent is employed after development Grant 5,234,793 - Sebald , et al. August 10, 1 | 1993-08-10 |
Etch-resistant deep ultraviolet resist process having an aromatic treating step after development Grant 5,173,393 - Sezi , et al. December 22, 1 | 1992-12-22 |
Photosensitive mixture Grant 5,081,000 - Kuehn , et al. January 14, 1 | 1992-01-14 |
Capacitive moisture-sensor Grant 5,040,090 - Birkle , et al. August 13, 1 | 1991-08-13 |
Method for manufacturing heat-stable structured layers from photopolymers which are addition reaction products of olefinic unsaturated monoisocyanates and phenol-formaldehyde resins Grant 4,975,347 - Ahne , et al. December 4, 1 | 1990-12-04 |
Heat resistant positive resists and method for preparing heat-resistant relief structures Grant 4,849,051 - Ahne , et al. July 18, 1 | 1989-07-18 |
Method for the production of heat-resistant structured layers Grant 4,828,948 - Ahne , et al. May 9, 1 | 1989-05-09 |
Polyether-based photopolymers Grant 4,732,951 - Ahne , et al. March 22, 1 | 1988-03-22 |
Method for the preparation of polyimide and polyisoindoloquinazoline dione precursors Grant 4,654,415 - Ahne , et al. March 31, 1 | 1987-03-31 |
Polyimidazole and polyimidazopyrrolone precursor stages and the preparation thereof Grant 4,397,999 - Ahne , et al. August 9, 1 | 1983-08-09 |
Method for the preparation of heat-resistant relief structures using positive resists Grant 4,395,482 - Ahne , et al. July 26, 1 | 1983-07-26 |
Polyimide, polyisoindoloquinazoline dione, polyoxazine dione and polyquinazoline dione precursor stages and the manufacture Grant 4,385,165 - Ahne , et al. May 24, 1 | 1983-05-24 |
Heat resistant positive resists containing polyoxazoles Grant 4,339,521 - Ahne , et al. July 13, 1 | 1982-07-13 |
Method for the preparation of highly heat-resistant relief Grant 4,332,882 - Ahne , et al. June 1, 1 | 1982-06-01 |
Method for the manufacture of highly heat-resistant relief structures Grant 4,332,883 - Ahne , et al. June 1, 1 | 1982-06-01 |
Method for the preparation of highly heat-resistant relief structures and the use thereof Grant 4,311,785 - Ahne , et al. January 19, 1 | 1982-01-19 |