Patent | Date |
---|
Parking control apparatus and parking control method App 20220089148 - AHN; Sang Ho | 2022-03-24 |
Method and apparatus for estimating state of waterproof paint of buildings using satellite imagery Grant 11,195,014 - Kang , et al. December 7, 2 | 2021-12-07 |
Exterior cap of transfer set for peritoneal dialysis Grant 9,629,950 - Park , et al. April 25, 2 | 2017-04-25 |
Watch Grant D778,178 - Lee , et al. February 7, 2 | 2017-02-07 |
Exterior Cap Of Transfer Set For Peritoneal Dialysis App 20150112249 - PARK; Jong Won ;   et al. | 2015-04-23 |
Electronic smart meter enabling demand response and method for demand response Grant 8,234,017 - Ahn July 31, 2 | 2012-07-31 |
Electronic Smart Meter Enabling Demand Response And Method For Demand Response App 20090198384 - AHN; Sang-Ho | 2009-08-06 |
Ultra-thin semiconductor package device and method for manufacturing the same Grant 7,253,026 - Ahn , et al. August 7, 2 | 2007-08-07 |
Bumped chip carrier package using lead frame and method for manufacturing the same App 20070108609 - Kang; In Ku ;   et al. | 2007-05-17 |
Method of forming a solder ball on a board and the board Grant 7,213,329 - Kim , et al. May 8, 2 | 2007-05-08 |
Bumped chip carrier package using lead frame and method for manufacturing the same Grant 7,109,065 - Kang , et al. September 19, 2 | 2006-09-19 |
Ultra-thin semiconductor package device and method for manufacturing the same App 20060110858 - Ahn; Sang-Ho ;   et al. | 2006-05-25 |
Ultra-thin semiconductor package device and method for manufacturing the same Grant 7,012,325 - Ahn , et al. March 14, 2 | 2006-03-14 |
TFT structure for high resolution digital X-ray detector Grant 7,012,259 - Nam , et al. March 14, 2 | 2006-03-14 |
Semiconductor chip stack structure and method for forming the same App 20060049528 - Kang; In-Ku ;   et al. | 2006-03-09 |
Method of forming a solder ball on a board and the board App 20060035453 - Kim; Seung-Woo ;   et al. | 2006-02-16 |
Semiconductor chip stack structure Grant 6,977,439 - Kang , et al. December 20, 2 | 2005-12-20 |
Bumped chip carrier package using lead frame and method for manufacturing the same App 20040253764 - Kang, In Ku ;   et al. | 2004-12-16 |
Bumped chip carrier package using lead frame Grant 6,818,976 - Kang , et al. November 16, 2 | 2004-11-16 |
Tft structure for high resolution digital x-ray detector App 20040200970 - Nam, Sang-Hee ;   et al. | 2004-10-14 |
Digital x-ray image detector App 20040200972 - Nam, Sang-Hee ;   et al. | 2004-10-14 |
Composite panel for reparing, reinforcing con'c body and method of using the same App 20040050006 - Park, Sang Tae ;   et al. | 2004-03-18 |
Semiconductor chip stack structure and method for forming the same App 20030178710 - Kang, In-Ku ;   et al. | 2003-09-25 |
Bumped chip carrier package using lead frame and method for manufacturing the same App 20030015780 - Kang, In Ku ;   et al. | 2003-01-23 |
Ultra-thin semiconductor package device and method for manufacturing the same App 20020121680 - Ahn, Sang-Ho ;   et al. | 2002-09-05 |
Dual die package and manufacturing method thereof App 20020113304 - Doh, Jae-Cheon ;   et al. | 2002-08-22 |
Large capacity optical ATM switch Grant 6,288,808 - Lee , et al. September 11, 2 | 2001-09-11 |
High speed tool steel, and manufacturing method therefor Grant 5,976,277 - Park , et al. November 2, 1 | 1999-11-02 |