loadpatents
name:-0.016868114471436
name:-0.011781930923462
name:-0.00064396858215332
Ahn; Sang H. Patent Filings

Ahn; Sang H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ahn; Sang H..The latest application filed is for "multi-stage curing of low k nano-porous films".

Company Profile
0.10.11
  • Ahn; Sang H. - Foster City CA
  • Ahn; Sang H. - Foster Cuty CA
  • Ahn; Sang H. - Santa Clara CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Maintenance of photoresist activity on the surface of dielectric arcs for 90 nm feature sizes
Grant 8,211,626 - Ahn , et al. July 3, 2
2012-07-03
Reduction in photoresist footing undercut during development of feature sizes of 120NM or less
Grant 8,088,563 - Ahn , et al. January 3, 2
2012-01-03
Techniques for the use of amorphous carbon (APF) for various etch and litho integration schemes
Grant 7,718,081 - Liu , et al. May 18, 2
2010-05-18
Multi-stage curing of low K nano-porous films
Grant 7,611,996 - Schmitt , et al. November 3, 2
2009-11-03
Techniques promoting adhesion of porous low K film to underlying barrier layer
Grant 7,547,643 - Schmitt , et al. June 16, 2
2009-06-16
Multi-stage Curing Of Low K Nano-porous Films
App 20080099920 - Schmitt; Francimar ;   et al.
2008-05-01
Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layers
Grant 7,297,376 - Yim , et al. November 20, 2
2007-11-20
Maintenance of photoresist adhesion on the surface of dielectric arcs for 90 NM feature sizes
App 20070154851 - Ahn; Sang H. ;   et al.
2007-07-05
Method to improve the ashing/wet etch damage resistance and integration stability of low dielectric constant films
App 20070134435 - Ahn; Sang H. ;   et al.
2007-06-14
Maintenance of photoresist activity on the surface of dielectric arcs for 90 nm feature sizes
App 20070117050 - Ahn; Sang H. ;   et al.
2007-05-24
Techniques For The Use Of Amorphous Carbon (apf) For Various Etch And Litho Integration Schemes
App 20060231524 - Liu; Wei ;   et al.
2006-10-19
Nitrogen-free dielectric anti-reflective coating and hardmask
Grant 7,105,460 - Kim , et al. September 12, 2
2006-09-12
Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme
Grant 7,064,078 - Liu , et al. June 20, 2
2006-06-20
Multi-stage curing of low K nano-porous films
App 20050230834 - Schmitt, Francimar ;   et al.
2005-10-20
Techniques promoting adhesion of porous low K film to underlying barrier layer
App 20050233591 - Schmitt, Francimar ;   et al.
2005-10-20
Nitrogen-free dielectric anti-reflective coating and hardmask
Grant 6,927,178 - Kim , et al. August 9, 2
2005-08-09
Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme
App 20050167394 - liu, Wei ;   et al.
2005-08-04
Maintenance of photoresist adhesion and activity on the surface of dielectric ARCS for 90 nm feature sizes
App 20050118541 - Ahn, Sang H. ;   et al.
2005-06-02
Nitrogen-free dielectric anti-reflective coating and hardmask
App 20040214446 - Kim, Bok Hoen ;   et al.
2004-10-28
Nitrogen-free dielectric anti-reflective coating and hardmask
App 20040009676 - Kim, Bok Hoen ;   et al.
2004-01-15
Method of forming a silicon nitride layer on a substrate
Grant 6,559,074 - Chen , et al. May 6, 2
2003-05-06

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