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Patent applications and USPTO patent grants for Ahn; Sang-Bin.The latest application filed is for "integrated circuit devices having buried interconnect structures therein that increase interconnect density".
Patent | Date |
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Integrated circuit devices having buried interconnect structures therein that increase interconnect density Grant 8,729,658 - Kim , et al. May 20, 2 | 2014-05-20 |
Integrated Circuit Devices Having Buried Interconnect Structures Therein That Increase Interconnect Density App 20130187291 - Kim; Bong-Soo ;   et al. | 2013-07-25 |
Semiconductor device and semiconductor module including the same Grant 8,405,185 - Kim , et al. March 26, 2 | 2013-03-26 |
Method Of Forming Semiconductor Devices With Buried Gate Electrodes And Devices Formed By The Same App 20120273791 - Kim; Bongsoo ;   et al. | 2012-11-01 |
Semiconductor Device And Method Of Fabricating The Same App 20120139021 - Kim; Seok-Hyun ;   et al. | 2012-06-07 |
Semiconductor Device and Semiconductor Module Including the Same App 20110175229 - Kim; Bong-Soo ;   et al. | 2011-07-21 |
Method Of Forming Semiconductor Devices With Buried Gate Electrodes And Devices Formed By The Same App 20110171800 - Kim; Bongsoo ;   et al. | 2011-07-14 |
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