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Patent applications and USPTO patent grants for Ahn; Min Seon.The latest application filed is for "semiconductor package and three-dimensional semiconductor package including the same".
Patent | Date |
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Electronic systems including heterogeneous multi-core processors and methods of operating same Grant 9,588,577 - Ahn , et al. March 7, 2 | 2017-03-07 |
Semiconductor Package And Three-dimensional Semiconductor Package Including The Same App 20160315029 - LEE; Dong-Han ;   et al. | 2016-10-27 |
Electronic Systems Including Heterogeneous Multi-core Processors And Methods Of Operating Same App 20150121105 - AHN; MIN SEON ;   et al. | 2015-04-30 |
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