Ahn; Mee-Hyun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ahn; Mee-Hyun.The latest application filed is for "leadframe package with dual lead configurations".
- Ahn; Mee-Hyun - Suwon-si KR
- Ahn; Mee-Hyun - Seoul KR
- Ahn, Mee-Hyun - Seoul-city KR
| Patent | Date |
|---|---|
| Leadframe package with dual lead configurations App 20090230520 - Lee; Jong-Joo ; et al. | 2009-09-17 |
| Pad arrangement in semiconductor memory device and method of driving semiconductor device Grant 7,200,067 - Ahn , et al. April 3, 2 | 2007-04-03 |
| Leadframe package with dual lead configurations App 20070040247 - Lee; Jong-Joo ; et al. | 2007-02-22 |
| Semiconductor packages with asymmetric connection configurations App 20060103002 - Ahn; Mee-Hyun ; et al. | 2006-05-18 |
| Semiconductor chip package and method App 20050104184 - Ahn, Mee-Hyun ; et al. | 2005-05-19 |
| Pad arrangement in semiconductor memory device and method of driving semiconductor device App 20040256641 - Ahn, Mee-Hyun ; et al. | 2004-12-23 |
| PAD arrangement in semiconductor memory device and method of driving semiconductor device Grant 6,806,582 - Ahn , et al. October 19, 2 | 2004-10-19 |
| PAD arrangement in semiconductor memory device and method of driving semiconductor device App 20020105097 - Ahn, Mee-Hyun ; et al. | 2002-08-08 |
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