loadpatents
Patent applications and USPTO patent grants for Ahn; Jeong Hoon.The latest application filed is for "semiconductor device and method for fabricating the same".
Patent | Date |
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Semiconductor Device And Method For Fabricating The Same App 20220310506 - Park; Jung Il ;   et al. | 2022-09-29 |
Semiconductor device and stacked semiconductor chips including through contacts Grant 11,437,374 - Ding , et al. September 6, 2 | 2022-09-06 |
Semiconductor Device App 20220278193 - DING; SHAOFENG ;   et al. | 2022-09-01 |
Semiconductor Device App 20220278024 - DING; SHAOFENG ;   et al. | 2022-09-01 |
Semiconductor Device And Stack Of Semiconductor Chips App 20220271045 - DING; Shaofeng ;   et al. | 2022-08-25 |
Semiconductor device Grant 11,257,754 - Lee , et al. February 22, 2 | 2022-02-22 |
Semiconductor Devices And Methods For Manufacturing The Same App 20220028827 - DING; Shaofeng ;   et al. | 2022-01-27 |
Semiconductor device and method of fabricating the same Grant 11,133,266 - Ding , et al. September 28, 2 | 2021-09-28 |
Semiconductor Devices App 20210296229 - PARK; Jinho ;   et al. | 2021-09-23 |
Semiconductor device Grant 11,114,524 - Ding , et al. September 7, 2 | 2021-09-07 |
Semiconductor Device And Method Of Fabricating The Same App 20210242147 - PARK; JINHO ;   et al. | 2021-08-05 |
Semiconductor Device And Stacked Semiconductor Chips App 20210242203 - DING; Shaofeng ;   et al. | 2021-08-05 |
Semiconductor Device App 20210233842 - LEE; JOON-NYUNG ;   et al. | 2021-07-29 |
Semiconductor devices Grant 11,043,456 - Park , et al. June 22, 2 | 2021-06-22 |
Semiconductor Device And Method Of Fabricating The Same App 20210125937 - DING; Shaofeng ;   et al. | 2021-04-29 |
Interposer And Method Of Manufacturing The Interposer App 20210118696 - DING; Shaofeng ;   et al. | 2021-04-22 |
Interposer Structure, Semiconductor Package Comprising The Same, And Method For Fabricating The Same App 20210118794 - DING; Shaofeng ;   et al. | 2021-04-22 |
Semiconductor device and method for fabricating the same Grant 10,892,318 - Ding , et al. January 12, 2 | 2021-01-12 |
Semiconductor device having buffer structure surrounding through via Grant 10,867,908 - Ding , et al. December 15, 2 | 2020-12-15 |
Semiconductor Devices App 20200350248 - PARK; Jinho ;   et al. | 2020-11-05 |
Semiconductor Device App 20200258976 - A1 | 2020-08-13 |
Semiconductor Device App 20200219810 - LEE; JOON-NYUNG ;   et al. | 2020-07-09 |
Semiconductor Device App 20200135843 - DING; Shaofeng ;   et al. | 2020-04-30 |
Semiconductor Device And Method For Fabricating The Same App 20200075712 - Ding; Shaofeng ;   et al. | 2020-03-05 |
Semiconductor Device And Method Of Fabricating The Same App 20200006199 - DING; Shaofeng ;   et al. | 2020-01-02 |
Semiconductor device Grant 10,424,513 - Park , et al. Sept | 2019-09-24 |
Semiconductor device, layout design method for the same and method for fabricating the same Grant 10,396,030 - Lee , et al. A | 2019-08-27 |
Semiconductor Device App 20190157150 - PARK; Jung Il ;   et al. | 2019-05-23 |
Semiconductor Device, Layout Design Method For The Same And Method For Fabricating The Same App 20190157198 - LEE; JOON-NYUNG ;   et al. | 2019-05-23 |
Wiring structures and semiconductor devices Grant 10,229,876 - Kim , et al. | 2019-03-12 |
Semiconductor devices including sealing regions and decoupling capacitor regions Grant 10,062,640 - Park , et al. August 28, 2 | 2018-08-28 |
Test structure and method of manufacturing structure including the same Grant 9,831,139 - Ding , et al. November 28, 2 | 2017-11-28 |
Apparatus and a method for assembling a 3D model Grant 9,798,834 - Ahn , et al. October 24, 2 | 2017-10-24 |
Wiring structure and method of forming the same, and semiconductor device including the wiring structure Grant 9,716,043 - Park , et al. July 25, 2 | 2017-07-25 |
Test Structure And Method Of Manufacturing Structure Including The Same App 20170207137 - DING; Shaofeng ;   et al. | 2017-07-20 |
Wiring Structure And Method Of Forming The Same, And Semiconductor Device Including The Wiring Structure App 20160379891 - PARK; JIN-HYEUNG ;   et al. | 2016-12-29 |
Wiring Structures And Semiconductor Devices App 20160343660 - KIM; Jun-Jung ;   et al. | 2016-11-24 |
Semiconductor Devices And Methods Of Manufacturing The Same App 20160343708 - PARK; Jungil ;   et al. | 2016-11-24 |
Semiconductor Devices Including Sealing Regions And Decoupling Capacitor Regions App 20160240475 - PARK; Chul-yong ;   et al. | 2016-08-18 |
Methods of testing integrated circuit devices using fuse elements Grant 9,087,803 - Ahn , et al. July 21, 2 | 2015-07-21 |
Apparatus And A Method For Assembling A 3d Model App 20140129185 - Ahn; Han Sik ;   et al. | 2014-05-08 |
Methods Of Testing Integrated Circuit Devices Using Fuse Elements App 20130130415 - AHN; Jeong-Hoon ;   et al. | 2013-05-23 |
Nozzle for vacuum cleaners Grant D669,238 - Ahn October 16, 2 | 2012-10-16 |
Semiconductor device having pads Grant 8,013,455 - Ahn , et al. September 6, 2 | 2011-09-06 |
Integrated circuit capacitor structure Grant 7,560,332 - Lee , et al. July 14, 2 | 2009-07-14 |
Semiconductor device and method of manufacturing the same Grant 7,417,302 - Lee , et al. August 26, 2 | 2008-08-26 |
Scribe-line Structures And Methods Of Forming The Same App 20080142927 - Ahn; Jeong-Hoon ;   et al. | 2008-06-19 |
Scribe-line structures and methods of forming the same Grant 7,358,155 - Ahn , et al. April 15, 2 | 2008-04-15 |
Method for damascene process Grant 7,351,653 - Ahn , et al. April 1, 2 | 2008-04-01 |
Metal line structures and methods of forming the same App 20080048339 - Ahn; Jeong-Hoon ;   et al. | 2008-02-28 |
Integrated Circuit Capacitor Structure App 20070184610 - Lee; Kyoung-woo ;   et al. | 2007-08-09 |
Integrated circuit capacitor structure Grant 7,229,875 - Lee , et al. June 12, 2 | 2007-06-12 |
Integrated Circuit Capacitor Structure App 20070072319 - AHN; Jeong-Hoon ;   et al. | 2007-03-29 |
Method for damascene process App 20070037383 - Ahn; Jeong-Hoon ;   et al. | 2007-02-15 |
Selective copper alloy interconnections in semiconductor devices and methods of forming the same App 20060289999 - Lee; Hyo-Jong ;   et al. | 2006-12-28 |
Integrated circuit capacitor structure Grant 7,154,162 - Ahn , et al. December 26, 2 | 2006-12-26 |
Scribe-line structures and methods of forming the same App 20060163701 - Ahn; Jeong-Hoon ;   et al. | 2006-07-27 |
Semiconductor device and method of manufacturing the same App 20060009065 - Lee; Kyoung-Woo ;   et al. | 2006-01-12 |
Void-free metal interconnection structure and method of forming the same Grant 6,953,745 - Ahn , et al. October 11, 2 | 2005-10-11 |
Void-free metal interconnection steucture and method of forming the same App 20050029010 - Ahn, Jeong-hoon ;   et al. | 2005-02-10 |
Semiconductor device including metal interconnection and metal resistor and method of manufacturing the same App 20040238962 - Jung, Mu-Kyeng ;   et al. | 2004-12-02 |
Integrated circuit capacitor structure App 20040137694 - Lee, Kyoung-Woo ;   et al. | 2004-07-15 |
Integrated circuit capacitor structure App 20040075131 - Ahn, Jeong-Hoon ;   et al. | 2004-04-22 |
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