Ahn; Byung Hoon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ahn; Byung Hoon.The latest application filed is for "leadframe and semiconductor package made using the leadframe".

Company Profile

0.14.14

Ahn; Byung Hoon - Seoul KR
Ahn; Byung Hoon - Singapore N/A SG
AHN; Byung Hoon - Hwaseong-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Leadframe and semiconductor package made using the leadframe Grant 9,362,210 - Ahn , et al. June 7, 2	2016-06-07
Integrated circuit leadframe and fabrication method therefor Grant 8,536,688 - Ahn , et al. September 17, 2	2013-09-17
Leadframe And Semiconductor Package Made Using The Leadframe App 20130181335 - Ahn; Byung Hoon ; et al.	2013-07-18
Method for Detecting Breakage of Diesel Particulate Filter App 20130144543 - AHN; Byung Hoon	2013-06-06
Leadframe and semiconductor package made using the leadframe Grant 8,410,585 - Ahn , et al. April 2, 2	2013-04-02
Semiconductor package with passive device integration Grant 7,960,816 - Chow , et al. June 14, 2	2011-06-14
Integrated circuit package system with down-set die pad and method of manufacture thereof Grant 7,833,840 - Ahn , et al. November 16, 2	2010-11-16
Integrated Circuit Package System With Down-set Die Pad App 20080032456 - Ahn; Byung Hoon ; et al.	2008-02-07
Thermally Enhanced Stacked Die Package And Fabrication Method App 20070148821 - Do; Byung Tai ; et al.	2007-06-28
Thermally enhanced stacked die package and fabrication method Grant 7,205,651 - Do , et al. April 17, 2	2007-04-17
Moisture resistant integrated circuit leadframe package Grant 7,135,760 - Han , et al. November 14, 2	2006-11-14
Semiconductor Package With Passive Device Integration App 20060197198 - Chow; Seng Guan ; et al.	2006-09-07
Semiconductor packages and leadframe assemblies Grant 7,091,596 - Han , et al. August 15, 2	2006-08-15
Leadframe and semiconductor package made using the leadframe App 20060151858 - Ahn; Byung Hoon ; et al.	2006-07-13
Integrated circuit leadframe with ground plane Grant 7,064,420 - Han , et al. June 20, 2	2006-06-20
Leadframe and semiconductor package made using the leadframe Grant 7,042,068 - Ahn , et al. May 9, 2	2006-05-09
Semiconductor package with passive device integration Grant 7,005,325 - Chow , et al. February 28, 2	2006-02-28
Integrated circuit leadframe and fabrication method therefor App 20050263861 - Ahn, Byung Hoon ; et al.	2005-12-01
Thermally enhanced stacked die package and fabrication method App 20050230800 - Do, Byung Tai ; et al.	2005-10-20
Semiconductor package with passive device integration App 20050173783 - Chow, Seng Guan ; et al.	2005-08-11
Semiconductor packages and leadframe assemblies App 20050087846 - Han, Byung Joon ; et al.	2005-04-28
Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof Grant 6,858,470 - Han , et al. February 22, 2	2005-02-22
Leadframe and semiconductor package made using the leadframe App 20050029638 - Ahn, Byung Hoon ; et al.	2005-02-10
Integrated circuit leadframe with ground plane App 20040061204 - Han, Byung Joon ; et al.	2004-04-01
Moisture resistant integrated circuit leadframe package App 20040061205 - Han, Byung Joon ; et al.	2004-04-01

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