| Patent | Date |
|---|
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
Grant 7,589,010 - Farnworth , et al. September 15, 2 | 2009-09-15 |
Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
Grant 7,169,693 - Akram , et al. January 30, 2 | 2007-01-30 |
Collars, support structures, and forms for protruding conductive structures
Grant 7,095,106 - Akram , et al. August 22, 2 | 2006-08-22 |
Stereolithographic method for fabricating stabilizers for semiconductor devices
Grant 7,041,533 - Akram , et al. May 9, 2 | 2006-05-09 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
Grant 6,998,334 - Farnworth , et al. February 14, 2 | 2006-02-14 |
Collars, support structures, and forms for protuding conductive structures
App 20060017175 - Akram; Salman ; et al. | 2006-01-26 |
Interconnecting substrates for electrical coupling of microelectronic components
Grant 6,983,551 - Ahmad January 10, 2 | 2006-01-10 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
App 20060003569 - Farnworth; Warren M. ; et al. | 2006-01-05 |
Interconnecting substrates for electrical coupling of microelectronic components
Grant 6,982,386 - Ahmad January 3, 2 | 2006-01-03 |
Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly
App 20050282313 - Akram, Salman ; et al. | 2005-12-22 |
Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof
App 20050208704 - Akram, Salman ; et al. | 2005-09-22 |
Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same
Grant 6,946,732 - Akram , et al. September 20, 2 | 2005-09-20 |
Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid
Grant 6,919,229 - Ahmad July 19, 2 | 2005-07-19 |
Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
Grant 6,911,735 - Akram , et al. June 28, 2 | 2005-06-28 |
Method of Interconnecting substrates for electrical coupling of microelectronic components
Grant 6,796,028 - Ahmad September 28, 2 | 2004-09-28 |
Programmed material consolidation systems including multiple fabrication sites and associated methods
App 20040164461 - Ahmad, Syed Sajid ; et al. | 2004-08-26 |
Handling system for use with programmable material consolidation systems and associated methods
App 20040167663 - Hiatt, William M. ; et al. | 2004-08-26 |
Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes
Grant 6,703,260 - Ahmad March 9, 2 | 2004-03-09 |
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
App 20040005770 - Farnworth, Warren M. ; et al. | 2004-01-08 |
Test carrier with molded interconnect for testing semiconductor components
Grant 6,642,730 - Hembree , et al. November 4, 2 | 2003-11-04 |
Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
App 20030203612 - Akram, Salman ; et al. | 2003-10-30 |
Interconnecting substrates for electrical coupling of microelectronic components
App 20030106709 - Ahmad, Syed Sajid | 2003-06-12 |
Interconnecting substrates for electrical coupling of microelectronic components
App 20030109083 - Ahmad, Syed Sajid | 2003-06-12 |
Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and mehtods of designing and fabricating such leadframes
App 20030104656 - Ahmad, Syed Sajid | 2003-06-05 |
Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pad, semiconductor device components including same, and methods for fabricating same
App 20030098499 - Akram, Salman ; et al. | 2003-05-29 |
Test carrier with molded interconnect for testing semiconductor components
Grant 6,544,461 - Hembree , et al. April 8, 2 | 2003-04-08 |
Interconnecting substrates for electrical coupling of microelectronic components
App 20030029633 - Ahmad, Syed Sajid | 2003-02-13 |
Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes
Grant 6,500,697 - Ahmad December 31, 2 | 2002-12-31 |
Interconnecting substrates for electrical coupling of microelectronic components
Grant 6,483,044 - Ahmad November 19, 2 | 2002-11-19 |
Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
App 20020105074 - Akram, Salman ; et al. | 2002-08-08 |
Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same
App 20020100973 - Akram, Salman ; et al. | 2002-08-01 |
Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes
App 20020048852 - Ahmad, Syed Sajid | 2002-04-25 |
Stereolithographic method and apparatus for fabricating stabilizers for flip-chip type semiconductor devices and resulting structures
App 20020043711 - Akram, Salman ; et al. | 2002-04-18 |
Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid
App 20020029741 - Ahmad, Syed Sajid | 2002-03-14 |
Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes
Grant 6,331,448 - Ahmad December 18, 2 | 2001-12-18 |
Flexible Conductive Structures And Method
App 20010050568 - AHMAD, SYED SAJID ; et al. | 2001-12-13 |
Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes
Grant 6,329,705 - Ahmad December 11, 2 | 2001-12-11 |
Test Carrier With Molded Interconnect For Testing Semiconductor Components
App 20010043074 - HEMBREE, DAVID R. ; et al. | 2001-11-22 |
Apparatus for applying viscous materials to a lead frame
App 20010009778 - Ahmad, Syed Sajid | 2001-07-26 |
Method and apparatus for applying viscous materials to a lead frame
Grant 6,204,093 - Ahmad March 20, 2 | 2001-03-20 |
Die positioning in integrated circuit packaging
Grant 6,194,251 - Ahmad February 27, 2 | 2001-02-27 |
Die positioning in integrated circuit packaging
Grant 5,994,784 - Ahmad November 30, 1 | 1999-11-30 |
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