Ahmad; Mudasir

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ahmad; Mudasir.The latest application filed is for "stiffener for providing uniformity in microelectronic packages".

Company Profile

5.21.18

Ahmad; Mudasir - San Jose CA
Ahmad; Mudasir - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stiffener for providing uniformity in microelectronic packages Grant 10,468,318 - Ahmad , et al. No	2019-11-05
Stiffener For Providing Uniformity In Microelectronic Packages App 20190237371 - Ahmad; Mudasir ; et al.	2019-08-01
Method And Apparatus To Prevent Laser Kink Failures App 20190207363 - Ahmad; Mudasir ; et al.	2019-07-04
Heat dissipation in hermetically-sealed packaged devices Grant 10,260,782 - Savic , et al.	2019-04-16
Method and apparatus to prevent laser kink failures Grant 10,230,212 - Ahmad , et al.	2019-03-12
Laser with pre-distorted grating Grant 10,186,839 - Liu , et al. Ja	2019-01-22
Heat Dissipation In Hermetically-sealed Packaged Devices App 20170234584 - Savic; Jovica ; et al.	2017-08-17
Heat dissipation in hermetically-sealed packaged devices Grant 9,688,453 - Savic , et al. June 27, 2	2017-06-27
Heat Dissipation in Hermetically-Sealed Packaged Devices App 20160229618 - Savic; Jovica ; et al.	2016-08-11
Electronic devices mounted on multiple substrates Grant 9,204,548 - Ahmad , et al. December 1, 2	2015-12-01
Real time strain sensing solution Grant 9,086,267 - Ahmad , et al. July 21, 2	2015-07-21
Method And Apparatus For Supporting A Computer Chip On A Printed Circuit Board Assembly App 20150173177 - Nagar; Mohan R. ; et al.	2015-06-18
Real Time Strain Sensing Solution App 20150059487 - Ahmad; Mudasir ; et al.	2015-03-05
Method and apparatus for supporting a computer chip on a printed circuit board assembly Grant 8,962,388 - Nagar , et al. February 24, 2	2015-02-24
Integrated circuit package lid configured for package coplanarity Grant 8,952,523 - Ahmad , et al. February 10, 2	2015-02-10
Lid for an electrical hardware component Grant 8,736,044 - Ahmad , et al. May 27, 2	2014-05-27
System In Package Module Assembly App 20130284796 - Nagar; Mohan R. ; et al.	2013-10-31
Electronic Devices Mounted On Multiple Substrates App 20130242496 - Ahmad; Mudasir ; et al.	2013-09-19
Method And Apparatus For Supporting A Computer Chip On A Printed Circuit Board Assembly App 20120113608 - Nagar; Mohan R. ; et al.	2012-05-10
Integrated Circuit Package Lid Configured For Package Coplanarity App 20120074557 - Ahmad; Mudasir ; et al.	2012-03-29
Lid For An Electrical Hardware Component App 20120018872 - Ahmad; Mudasir ; et al.	2012-01-26
Method and apparatus for supporting a computer chip on a printed circuit board assembly Grant 8,081,484 - Nagar , et al. December 20, 2	2011-12-20
Conductive dome probes for measuring system level multi-GHZ signals Grant 7,797,663 - Bird , et al. September 14, 2	2010-09-14
Attaching A Lead-free Component To A Printed Circuit Board Under Lead-based Assembly Conditions App 20090310318 - Ahmad; Mudasir	2009-12-17
Method and apparatus for strain monitoring of printed circuit board assemblies Grant 7,621,190 - Ahmad , et al. November 24, 2	2009-11-24
Techniques for providing electrical and thermal conductivity between electrical components and printed circuit boards using sleeves defining substantially conical shapes Grant 7,604,491 - Ahmad , et al. October 20, 2	2009-10-20
Conductive Dome Probes For Measuring System Level Multi-ghz Signals App 20080250377 - Bird; Steven C. ; et al.	2008-10-09
Method and apparatus for supporting a computer chip on a printed circuit board assembly App 20080130241 - Nagar; Mohan R. ; et al.	2008-06-05
Device, apparatus, method and assembly for coupling an electrical component with a circuit board Grant 7,277,297 - Ahmad , et al. October 2, 2	2007-10-02
Method and apparatus for strain monitoring of printed circuit board assemblies App 20070205791 - Ahmad; Mudasir ; et al.	2007-09-06
Device, apparatus, method and assembly for coupling an electrical component with a circuit board App 20060193118 - Ahmad; Mudasir ; et al.	2006-08-31
Methods and apparatus for thermally coupling a heat sink to a circuit board component Grant 7,019,976 - Ahmad , et al. March 28, 2	2006-03-28
Methods and apparatus for cooling a circuit board component Grant 6,728,104 - Ahmad , et al. April 27, 2	2004-04-27

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