loadpatents
name:-0.17071914672852
name:-0.045168876647949
name:-0.00071001052856445
Ahiko; Taisuke Patent Filings

Ahiko; Taisuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ahiko; Taisuke.The latest application filed is for "chip type electronic component for test, and mounted state test method".

Company Profile
0.28.23
  • Ahiko; Taisuke - Nikaho JP
  • Ahiko; Taisuke - Nikaho-shi JP
  • Ahiko; Taisuke - Nikaho-machi JP
  • Ahiko; Taisuke - Nikaho-city JP
  • Ahiko; Taisuke - Tokyo JP
  • Ahiko; Taisuke - Akita-ken JP
  • Ahiko; Taisuke - Chuo-ku JP
  • Ahiko; Taisuke - Konouramachi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for mounting chip component and circuit board
Grant 7,735,713 - Kataoka , et al. June 15, 2
2010-06-15
Electronic component series
Grant 7,584,853 - Yoshii , et al. September 8, 2
2009-09-08
Multilayer capacitor
Grant 7,586,174 - Togashi , et al. September 8, 2
2009-09-08
Chip type electronic component for test, and mounted state test method
Grant 7,391,219 - Ahiko , et al. June 24, 2
2008-06-24
Multilayer capacitor and method of adjusting equivalent series resistance of multilayer capacitor
Grant 7,388,737 - Togashi , et al. June 17, 2
2008-06-17
Electronic component and electronic device
Grant 7,339,781 - Yoshii , et al. March 4, 2
2008-03-04
Laminated capacitor and manufacturing method thereof
Grant 7,312,975 - Togashi , et al. December 25, 2
2007-12-25
Ceramic electronic component and multilayer capacitor
Grant 7,304,831 - Yoshii , et al. December 4, 2
2007-12-04
Multilayer capacitor and method of adjusting equivalent series resistance of multilayer capacitor
Grant 7,298,604 - Togashi , et al. November 20, 2
2007-11-20
Chip type electronic component for test, and mounted state test method
App 20070242405 - Ahiko; Taisuke ;   et al.
2007-10-18
Method For Mounting Chip Component And Circuit Board
App 20070145101 - Kataoka; Naruki ;   et al.
2007-06-28
Multilayer capacitor
Grant 7,224,569 - Togashi , et al. May 29, 2
2007-05-29
Multilayer capacitor
Grant 7,224,572 - Togashi , et al. May 29, 2
2007-05-29
Multilayer capacitor
Grant 7,196,897 - Togashi , et al. March 27, 2
2007-03-27
Laminated capacitor and manufacturing method thereof
App 20070064374 - Togashi; Masaaki ;   et al.
2007-03-22
Chip-type electronic component
Grant 7,177,138 - Yoshii , et al. February 13, 2
2007-02-13
Multilayer capacitor
App 20070025057 - Togashi; Masaaki ;   et al.
2007-02-01
Multilayer capacitor
App 20060203426 - Togashi; Masaaki ;   et al.
2006-09-14
Multilayer capacitor
App 20060203427 - Togashi; Masaaki ;   et al.
2006-09-14
Multilayer capacitor
App 20060203425 - Togashi; Masaaki ;   et al.
2006-09-14
Electronic component and electronic device
App 20060193103 - Yoshii; Akitoshi ;   et al.
2006-08-31
Multilayer capacitor
Grant 7,099,138 - Togashi , et al. August 29, 2
2006-08-29
Ceramic electronic component and multilayer capacitor
App 20060187613 - Yoshii; Akitoshi ;   et al.
2006-08-24
Multilayer Capacitor
App 20060176644 - Togashi; Masaaki ;   et al.
2006-08-10
Multilayer capacitor and method of adjusting equivalent series resistance of multilayer capacitor
App 20060164789 - Togashi; Masaaki ;   et al.
2006-07-27
Multilayer capacitor and method of adjusting equivalent series resistance of multilayer capacitor
App 20060152886 - Togashi; Masaaki ;   et al.
2006-07-13
Multilayer capacitor
Grant 7,075,774 - Togashi , et al. July 11, 2
2006-07-11
Electronic component series
App 20060138019 - Yoshii; Akitoshi ;   et al.
2006-06-29
Chip-type electronic component
App 20060126264 - Yoshii; Akitoshi ;   et al.
2006-06-15
Laminated ceramic capacitor
Grant 7,050,288 - Ahiko , et al. May 23, 2
2006-05-23
Multilayer capacitor
Grant 6,999,300 - Togashi , et al. February 14, 2
2006-02-14
Multilayer capacitor
App 20060007634 - Togashi; Masaaki ;   et al.
2006-01-12
Electronic device
Grant 6,958,899 - Togashi , et al. October 25, 2
2005-10-25
Multilayer capacitor
App 20050207093 - Togashi, Masaaki ;   et al.
2005-09-22
Laminated ceramic capacitor
App 20050201040 - Ahiko, Taisuke ;   et al.
2005-09-15
Electronic device and interposer board
Grant 6,807,047 - Togashi , et al. October 19, 2
2004-10-19
Electronic device
App 20040183147 - Togashi, Masaaki ;   et al.
2004-09-23
Multilayer electronic device and method for producing same
Grant 6,657,848 - Togashi , et al. December 2, 2
2003-12-02
Chip-type electronic component
Grant 6,576,497 - Ahiko , et al. June 10, 2
2003-06-10
Multiterminal multilayer ceramic electronic device
App 20030011963 - Ahiko, Taisuke ;   et al.
2003-01-16
Multilayer electronic device and method for producing same
App 20020171997 - Togashi, Masaaki ;   et al.
2002-11-21
Multilayer electronic device
Grant 6,452,781 - Ahiko , et al. September 17, 2
2002-09-17
Multilayer electronic device and method for producing same
Grant 6,441,459 - Togashi , et al. August 27, 2
2002-08-27
Multilayer ceramic capacitor
Grant 6,407,907 - Ahiko , et al. June 18, 2
2002-06-18
Multiterminal-multilayer ceramic capacitor
Grant 6,407,906 - Ahiko , et al. June 18, 2
2002-06-18
Chip-type electronic component
App 20020070442 - Ahiko, Taisuke ;   et al.
2002-06-13
Chip-type electronic component having external electrodes that are spaced at predetermined distances from side surfaces of a ceramic substrate
Grant 6,380,619 - Ahiko , et al. April 30, 2
2002-04-30
Multilayer electronic device
App 20020041006 - Ahiko, Taisuke ;   et al.
2002-04-11
Multilayer ceramic capacitor for three-dimensional mounting
Grant 6,292,351 - Ahiko , et al. September 18, 2
2001-09-18
Chip-type Electronic Component
App 20010019176 - AHIKO, TAISUKE ;   et al.
2001-09-06
Chip type laminated ceramic capacitor
Grant 6,104,599 - Ahiko , et al. August 15, 2
2000-08-15

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