Agrawal; Vaibhav
Patent Applications and Registrations
Patent applications and USPTO patent grants for Agrawal; Vaibhav.The latest application filed is for "dummy die in a recessed mold structure of a packaged integrated circuit device".
- Agrawal; Vaibhav - Chandler AZ
- AGRAWAL; Vaibhav - Pimpri-Chinchwad IN
- Agrawal; Vaibhav - Eden Prairie MN
- Agrawal; Vaibhav - Minneapolis MN
| Patent | Date |
|---|---|
| Dummy Die In A Recessed Mold Structure Of A Packaged Integrated Circuit Device App 20220102231 - Modi; Mitul ; et al. | 2022-03-31 |
| Dummy Die Structures Of A Packaged Integrated Circuit Device App 20220102242 - Modi; Mitul ; et al. | 2022-03-31 |
| Sequencer Device App 20200179982 - SHAH; Tanay ; et al. | 2020-06-11 |
| System And Method For Automatic Sequencing Of Shipments App 20200184418 - SHAH; Tanay ; et al. | 2020-06-11 |
| Demand-based product sourcing Grant 10,636,079 - Shiely , et al. | 2020-04-28 |
| Demand-based Product Sourcing App 20170083967 - Shiely; Brent ; et al. | 2017-03-23 |
| Delayed Order Delivery Fulfillment App 20160328781 - Patel-Zellinger; Sanu ; et al. | 2016-11-10 |
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