| Patent | Date |
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Evaluating On-device Machine Learning Model(s) Based On Performance Measures Of Client Device(s) And/or The On-device Machine Learning Model(s)
App 20220309389 - Zivkovic; Dragan ; et al. | 2022-09-29 |
Evaluating New Feature(s) For Client Device(s) Based On Performance Measure(s)
App 20220308975 - Zivkovic; Dragan ; et al. | 2022-09-29 |
System and method for managing recovery of multi-controller NVMe drives
Grant 10,983,879 - Agrawal , et al. April 20, 2 | 2021-04-20 |
Techniques For Notifying Persons Within A Vicinity Of A Patient Support Apparatus Of A Remote Control Function
App 20210106478 - Sidhu; Anuj ; et al. | 2021-04-15 |
Techniques for notifying persons within a vicinity of a patient support apparatus of a remote control function
Grant 10,905,611 - Sidhu , et al. February 2, 2 | 2021-02-02 |
Bonding of laminates with electrical interconnects
Grant 10,790,222 - Delacruz , et al. September 29, 2 | 2020-09-29 |
Software Service Intervention In A Computing System
App 20200133701 - Agrawal; Akash ; et al. | 2020-04-30 |
Thermoelectric Heat Exchanger For An Hvac System
App 20200056795 - Mishra; Ankur ; et al. | 2020-02-20 |
Bonding Of Laminates With Electrical Interconnects
App 20190221510 - Delacruz; Javier A. ; et al. | 2019-07-18 |
Multi-surface edge pads for vertical mount packages and methods of making package stacks
Grant 10,354,945 - Katkar , et al. July 16, 2 | 2019-07-16 |
Techniques For Notifying Persons Within A Vicinity Of A Patient Support Apparatus Of A Remote Control Function
App 20190192368 - Sidhu; Anuj ; et al. | 2019-06-27 |
Bonding of laminates with electrical interconnects
Grant 10,283,445 - Delacruz , et al. | 2019-05-07 |
Wafer-level packaging using wire bond wires in place of a redistribution layer
Grant 10,008,469 - Katkar , et al. June 26, 2 | 2018-06-26 |
Bonding of Laminates with Electrical Interconnects
App 20180114747 - Delacruz; Javier A. ; et al. | 2018-04-26 |
Multi-surface edge pads for vertical mount packages and methods of making package stacks
App 20180040544 - Katkar; Rajesh Emeka ; et al. | 2018-02-08 |
Methods and structures to repair device warpage
Grant 9,859,234 - Uzoh , et al. January 2, 2 | 2018-01-02 |
Fan-out wafer-level packaging using metal foil lamination
Grant 9,847,238 - Li , et al. December 19, 2 | 2017-12-19 |
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
Grant 9,824,974 - Gao , et al. November 21, 2 | 2017-11-21 |
Enhanced density assembly having microelectronic packages mounted at substantial angle to board
Grant 9,728,524 - Tao , et al. August 8, 2 | 2017-08-08 |
Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
App 20170170031 - Li; Xuan ; et al. | 2017-06-15 |
Fan-out wafer-level packaging using metal foil lamination
Grant 9,646,946 - Li , et al. May 9, 2 | 2017-05-09 |
Fan-out Wafer-level Packaging Using Metal Foil Lamination
App 20170103957 - Li; Xuan ; et al. | 2017-04-13 |
Integrated Circuit Assemblies With Rigid Layers Used For Protection Against Mechanical Thinning And For Other Purposes, And Methods Of Fabricating Such Assemblies
App 20170084539 - GAO; Guilian ; et al. | 2017-03-23 |
Wafer-level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer
App 20170069591 - Katkar; Rajesh ; et al. | 2017-03-09 |
Methods And Structures To Repair Device Warpage
App 20170040270 - Uzoh; Cyprian Emeka ; et al. | 2017-02-09 |
Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
Grant 9,548,273 - Gao , et al. January 17, 2 | 2017-01-17 |
Wafer level packages with mechanically decoupled fan-in and fan-out areas
Grant 9,543,277 - Lee , et al. January 10, 2 | 2017-01-10 |
Wafer-level packaging using wire bond wires in place of a redistribution layer
Grant 9,502,372 - Katkar , et al. November 22, 2 | 2016-11-22 |
Wafer-level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer
App 20160322326 - KATKAR; Rajesh ; et al. | 2016-11-03 |
Method and apparatus for document conversion with font metrics adjustment for format compatibility
Grant 9,471,550 - Boutelle , et al. October 18, 2 | 2016-10-18 |
Integrated Circuit Assemblies With Rigid Layers Used For Protection Against Mechanical Thinning And For Other Purposes, And Methods Of Fabricating Such Assemblies
App 20160163650 - GAO; Guilian ; et al. | 2016-06-09 |
System And Method For Screening Applicants
App 20150006417 - Agrawal; Akash | 2015-01-01 |
Method And Apparatus For Document Conversion
App 20140108897 - Boutelle; Jonathan ; et al. | 2014-04-17 |
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