Adventive IPBank
Patent Applications and Registrations
Patent applications and USPTO patent grants for Adventive IPBank.The latest application filed is for "method of fabricating 3d bendable printed circuit board".
- Adventive IPBank - Luxembourg LU
- Adventive IPBank - Cupertino CA
| Patent | Date |
|---|---|
| Universal surface-mount semiconductor package Grant 10,615,146 - Williams , et al. | 2020-04-07 |
| Method of fabricating low-profile footed power package Grant 10,312,111 - Williams , et al. | 2019-06-04 |
| Method Of Fabricating 3D Bendable Printed Circuit Board App 20180343741 - Williams; Richard K. ; et al. | 2018-11-29 |
| Method Of Fabricating Low-Profile Footed Power Package App 20180330968 - Williams; Richard K. ; et al. | 2018-11-15 |
| Universal Surface-Mount Semiconductor Package App 20180331067 - Williams; Richard K. ; et al. | 2018-11-15 |
| 3D bendable printed circuit board with redundant interconnections Grant 10,064,276 - Williams , et al. August 28, 2 | 2018-08-28 |
| Method of fabricating low-profile footed power package Grant 10,032,649 - Williams , et al. July 24, 2 | 2018-07-24 |
| Universal surface-mount semiconductor package Grant 10,032,744 - Williams , et al. July 24, 2 | 2018-07-24 |
| Low profile leaded semiconductor package and method of fabricating the same Grant 10,008,438 - Williams June 26, 2 | 2018-06-26 |
| Method Of Fabricating Low Profile Leaded Semiconductor Package App 20180040545 - Williams; Richard K. | 2018-02-08 |
| Method Of Fabricating Low-Profile Footed Power Package App 20170178928 - Williams; Richard K. ; et al. | 2017-06-22 |
| Universal Surface-Mount Semiconductor Package App 20170170144 - Williams; Richard K. ; et al. | 2017-06-15 |
| Low Profile Leaded Semiconductor Package App 20170133304 - Williams; Richard K | 2017-05-11 |
| 3D Bendable Printed Circuit Board With Redundant Interconnections App 20170118838 - Williams; Richard K. ; et al. | 2017-04-27 |
| Low-profile footed power package Grant 9,620,439 - Williams , et al. April 11, 2 | 2017-04-11 |
| Low profile leaded semiconductor package Grant 9,576,884 - Williams February 21, 2 | 2017-02-21 |
| Universal surface-mount semiconductor package Grant 9,576,932 - Williams , et al. February 21, 2 | 2017-02-21 |
| Universal Surface-Mount Semiconductor Package App 20150380384 - Williams; Richard K. ; et al. | 2015-12-31 |
| Low-Profile Footed Power Package App 20150311144 - Williams; Richard K. ; et al. | 2015-10-29 |
| Low Profile Leaded Semiconductor Package App 20140306330 - Williams; Richard K. | 2014-10-16 |
| Cloud Based System For Remote Medical Checkup And Physician Managed Biometric Data App 20140257833 - Williams; Richard K | 2014-09-11 |
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