ADVANCE SEMICONDUCTOR ENGINEERING, INC.
Patent Applications and Registrations
Patent applications and USPTO patent grants for ADVANCE SEMICONDUCTOR ENGINEERING, INC..The latest application filed is for "silicon chip having through via and method for making the same".
- ADVANCE SEMICONDUCTOR ENGINEERING, INC. - Kaohsiung TW
- Advance Semiconductor Engineering Inc. -
| Patent | Date |
|---|---|
| Semiconductor substrate, semiconductor package, and method for forming the same Grant 10,665,523 - Ho , et al. | 2020-05-26 |
| Semiconductor package having passive device and method for making the same Grant 8,415,790 - Chen , et al. April 9, 2 | 2013-04-09 |
| Silicon Chip Having Through Via and Method for Making the Same App 20130032889 - Yang; Hsueh-An ; et al. | 2013-02-07 |
| Method for fabricating quad flat non-leaded package Grant 7,351,612 - Gai April 1, 2 | 2008-04-01 |
| Package of image sensor device and formation thereof App 20060211173 - Hsiao; Wei-Min ; et al. | 2006-09-21 |
| Lead-free conductive jointing bump App 20050275098 - Wu, Jeng-Da | 2005-12-15 |
| Asymmetric bump structure App 20050263883 - Wang, Tong-Hong ; et al. | 2005-12-01 |
| Structure and method of forming metal buffering layer App 20050266667 - Huang, Tai-Yuan | 2005-12-01 |
| Stacked flip chip package Grant 6,921,968 - Chung July 26, 2 | 2005-07-26 |
| Singulation method used in leadless packaging process App 20050037618 - Lee, Jun Hong ; et al. | 2005-02-17 |
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