ADP Engineering Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for ADP Engineering Co., Ltd..The latest application filed is for "apparatus and method for attaching substrates".

Company Profile

1.18.9

ADP Engineering Co., Ltd. - Seongnam-Si Gyeonggi-Do KR
ADP Engineering Co., Ltd. - KR KR
ADP Engineering Co., Ltd. - Seongnam-Si, Gyeonggi-Do KR
ADP Engineering Co., Ltd. - Gyeongki-Do KR
ADP Engineering Co.,Ltd. -

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate damage prevention system and method Grant 8,845,810 - Hwang September 30, 2	2014-09-30
Process chamber having gate slit opening and closing apparatus Grant 8,834,673 - Son September 16, 2	2014-09-16
Organic deposition apparatus and method of depositing organic substance using the same Grant 08617314 -	2013-12-31
Organic deposition apparatus and method of depositing organic substance using the same Grant 8,617,314 - An , et al. December 31, 2	2013-12-31
Apparatus for attaching substrates and gap control unit thereof Grant 8,529,715 - Choi , et al. September 10, 2	2013-09-10
System and method for introducing a substrate into a process chamber Grant 8,462,008 - Lee June 11, 2	2013-06-11
System and method for introducing a substrate into a process chamber Grant 8,462,009 - Lee June 11, 2	2013-06-11
Apparatus for attaching substrates and gap control unit thereof Grant 8,388,781 - Choi , et al. March 5, 2	2013-03-05
Electrostatic chuck and apparatus having the same Grant 8,363,377 - Hwang January 29, 2	2013-01-29
Apparatus for attaching substrates of flat display panel Grant 8,256,101 - Shim September 4, 2	2012-09-04
Apparatus and method for attaching substrates Grant 8,072,573 - Hwang , et al. December 6, 2	2011-12-06
Lift pin driving device and a flat panel display manufacturing apparatus having same Grant 7,988,817 - Son August 2, 2	2011-08-02
Adhesive chuck and substrate bonding apparatus Grant 7,980,287 - Hwang July 19, 2	2011-07-19
Apparatus And Method For Attaching Substrates App 20110067805 - HWANG; Jae Seok ; et al.	2011-03-24
Substrate bonding apparatus having alignment unit and method of aligning substrates using the same Grant 7,896,046 - Park March 1, 2	2011-03-01
Apparatus and method for attaching substrates Grant 7,864,289 - Hwang , et al. January 4, 2	2011-01-04
Apparatus and method for measuring chuck attachment force Grant 7,770,478 - Son August 10, 2	2010-08-10
Apparatus for attaching substrates Grant 7,765,682 - Hwang , et al. August 3, 2	2010-08-03
System and method for introducing a substrate into a process chamber Grant 7,750,818 - Lee July 6, 2	2010-07-06
System And Method For Introducing A Substrate Into A Process Chamber App 20100148978 - LEE; In Taek	2010-06-17
System And Method For Introducing A Substrate Into A Process Chamber App 20100148979 - LEE; In Taek	2010-06-17
Apparatus for attaching substrates Grant 7,640,960 - Kim , et al. January 5, 2	2010-01-05
Apparatus Amd Method For Measuring Chuck Attachment Force App 20090107250 - SON; Hyoung Kyu	2009-04-30
Apparatus And Method For Attaching Substrates App 20080135127 - HWANG; Jae Seok ; et al.	2008-06-12
Apparatus For Attaching Substrates And Gap Control Unit Thereof App 20080139074 - CHOI; Bong Hwan ; et al.	2008-06-12
Process Chamber Having Gate Slit Opening And Closing Apparatus App 20080110568 - SON; Hyoung Kyu	2008-05-15
Substrate bonding apparatus having alignment unit and method of aligning substrates using the same App 20080047651 - Park; Si Hyun	2008-02-28
Apparatus for attaching substrates of flat display panel App 20080040916 - Shim; Seok Hee	2008-02-21

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