ADL ENGINEERING INC.

Patent Applications and Registrations

Patent applications and USPTO patent grants for ADL ENGINEERING INC..The latest application filed is for "electronic package and package carrier".

Company Profile

1.9.6

ADL ENGINEERING INC. - Hsin-Chu N/A TW
ADL ENGINEERING INC. - Hsin-Chu County TW
ADL Engineering Inc. - Hsinchu County TW
ADL Engineering Inc. - Hukou Township Hsinchu County TW
ADL Engineering Inc. -

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic package having a supporting board and package carrier thereof Grant 9,865,561 - Jow , et al. January 9, 2	2018-01-09
Electronic Package And Package Carrier App 20170170138 - JOW; EN-MIN ; et al.	2017-06-15
Electronic package, package carrier, and method of manufacturing package carrier Grant 9,603,246 - Jow , et al. March 21, 2	2017-03-21
Electronic Package, Package Carrier, And Methods Of Manufacturing Electronic Package And Package Carrier App 20150262927 - KANG; CHENG-YU ; et al.	2015-09-17
Electronic Package, Package Carrier, And Method Of Manufacturing Package Carrier App 20150162275 - JOW; EN-MIN ; et al.	2015-06-11
Package structure Grant 8,749,048 - Lin , et al. June 10, 2	2014-06-10
Conductive line structure and the method of forming the same Grant 8,637,402 - Hu , et al. January 28, 2	2014-01-28
Three-dimensional system-in-package package-on-package structure Grant 8,619,431 - Lin , et al. December 31, 2	2013-12-31
Three-dimensional system-in-package package-on-package structure Grant 08619431 -	2013-12-31
Chip packaging structure Grant 8,304,923 - Hu , et al. November 6, 2	2012-11-06
Injection molding system and method of chip package Grant 8,293,572 - Chen , et al. October 23, 2	2012-10-23
Injection Molding System And Method Of Chip Package App 20120187582 - Chen; Wen-Chuan ; et al.	2012-07-26
EMI Shielding in a Package Module App 20120188727 - LIN; Nan-Chun ; et al.	2012-07-26
Three-dimensional System-in-package Package-on-package Structure App 20120161315 - Lin; Nan-Chun ; et al.	2012-06-28

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.