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Patent applications and USPTO patent grants for ADACHI; Takema.The latest application filed is for "wiring substrate and method for manufacturing wiring substrate".
Patent | Date |
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Wiring Substrate And Method For Manufacturing Wiring Substrate App 20220248533 - ADACHI; Takema ;   et al. | 2022-08-04 |
Wiring Substrate And Method For Manufacturing Wiring Substrate App 20220248531 - ADACHI; Takema ;   et al. | 2022-08-04 |
Wiring Substrate And Method For Manufacturing Wiring Substrate App 20220077046 - ADACHI; Takema ;   et al. | 2022-03-10 |
Printed wiring board Grant 10,645,819 - Furutani , et al. | 2020-05-05 |
Method for manufacturing electronic component attached wiring board Grant 10,477,699 - Adachi , et al. Nov | 2019-11-12 |
Printed wiring board Grant 10,440,823 - Adachi , et al. O | 2019-10-08 |
Printed wiring board Grant 10,405,426 - Adachi , et al. Sep | 2019-09-03 |
Printed wiring board Grant 10,375,828 - Adachi , et al. | 2019-08-06 |
Printed wiring board Grant 10,368,440 - Adachi , et al. July 30, 2 | 2019-07-30 |
Printed Wiring Board App 20190215959 - ADACHI; Takema ;   et al. | 2019-07-11 |
Printed Wiring Board App 20190200462 - Furutani; Toshiki ;   et al. | 2019-06-27 |
Printed wiring board Grant 10,314,168 - Adachi , et al. | 2019-06-04 |
Printed Wiring Board App 20190124768 - ADACHI; Takema ;   et al. | 2019-04-25 |
Printed Wiring Board App 20190124767 - ADACHI; Takema ;   et al. | 2019-04-25 |
Printed Wiring Board App 20190124766 - ADACHI; Takema ;   et al. | 2019-04-25 |
Printed Wiring Board App 20190124765 - Adachi; Takema ;   et al. | 2019-04-25 |
Shield cap and method for manufacturing the same Grant 10,271,468 - Furutani , et al. | 2019-04-23 |
Printed wiring board for mounting electronic component Grant 10,231,336 - Furutani , et al. | 2019-03-12 |
Shield cap and method for manufacturing the same Grant 10,231,369 - Furutani , et al. | 2019-03-12 |
Method for manufacturing wiring board with conductive post Grant 10,221,497 - Noda , et al. | 2019-03-05 |
Printed wiring board and method for manufacturing the same Grant 10,219,383 - Kitagawa , et al. Feb | 2019-02-26 |
Shield cap and method for manufacturing the same Grant 10,194,569 - Furutani , et al. Ja | 2019-01-29 |
Shield cap and method for manufacturing the same Grant 10,182,518 - Furutani , et al. Ja | 2019-01-15 |
Printed Wiring Board And Method For Manufacturing The Same App 20180270958 - KITAGAWA; Katsutoshi ;   et al. | 2018-09-20 |
Printed Wiring Board App 20180270951 - Furutani; Toshiki ;   et al. | 2018-09-20 |
Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same Grant 10,070,523 - Sakai , et al. September 4, 2 | 2018-09-04 |
Printed wiring board Grant 9,980,371 - Katsuno , et al. May 22, 2 | 2018-05-22 |
Shield Cap And Method For Manufacturing The Same App 20180110161 - FURUTANI; Toshiki ;   et al. | 2018-04-19 |
Shield Cap And Method For Manufacturing The Same App 20180110159 - FURUTANI; Toshiki ;   et al. | 2018-04-19 |
Shield Cap And Method For Manufacturing The Same App 20180110164 - FURUTANI; Toshiki ;   et al. | 2018-04-19 |
Shield Cap And Method For Manufacturing The Same App 20180110163 - FURUTANI; Toshiki ;   et al. | 2018-04-19 |
Interposer and circuit substrate Grant 9,837,345 - Noda , et al. December 5, 2 | 2017-12-05 |
Method For Manufacturing Electronic Component Attached Wiring Board App 20170257952 - ADACHI; Takema ;   et al. | 2017-09-07 |
Printed Wiring Board And Semiconductor Package App 20170053878 - KAJIHARA; Kazuki ;   et al. | 2017-02-23 |
Printed Wiring Board, Semiconductor Package, And Method For Manufacturing Printed Wiring Board App 20170033036 - KAJIHARA; Kazuki ;   et al. | 2017-02-02 |
Interposer And Circuit Substrate App 20170018494 - NODA; Kota ;   et al. | 2017-01-19 |
Printed Wiring Board And Method For Manufacturing The Same App 20160316558 - SAKAI; Shunsuke ;   et al. | 2016-10-27 |
Printed Wiring Board And Method For Manufacturing The Same App 20160295692 - ASANO; Koji ;   et al. | 2016-10-06 |
Printed Wiring Board App 20160242285 - Katsuno; Takayuki ;   et al. | 2016-08-18 |
Method for manufacturing multilayer printed wiring board Grant 9,420,708 - Hibino , et al. August 16, 2 | 2016-08-16 |
Combined substrate Grant 9,401,320 - Daizo , et al. July 26, 2 | 2016-07-26 |
Printed Wiring Board App 20160014898 - Adachi; Takema ;   et al. | 2016-01-14 |
Printed wiring board Grant 9,185,799 - Ishida , et al. November 10, 2 | 2015-11-10 |
Method For Manufacturing Wiring Board With Conductive Post App 20150271929 - NODA; Kota ;   et al. | 2015-09-24 |
Combined Substrate App 20150255433 - DAIZO; Tomoya ;   et al. | 2015-09-10 |
Printed wiring board and method for manufacturing the same Grant 9,078,366 - Adachi July 7, 2 | 2015-07-07 |
Printed wiring board Grant 9,048,229 - Ishida , et al. June 2, 2 | 2015-06-02 |
Printed Wiring Board With Metal Post And Method For Manufacturing Printed Wiring Board With Metal Post App 20150077963 - ADACHI; Takema ;   et al. | 2015-03-19 |
Printed Wiring Board App 20150062849 - ADACHI; Takema ;   et al. | 2015-03-05 |
Method for manufacturing multilayer printed wiring board Grant 8,931,168 - Hibino , et al. January 13, 2 | 2015-01-13 |
Printed Wiring Board App 20140246765 - ISHIDA; Naoto ;   et al. | 2014-09-04 |
Printed wiring board and method for manufacturing printed wiring board Grant 8,772,646 - Ueda , et al. July 8, 2 | 2014-07-08 |
Printed wiring board Grant 8,742,553 - Ishida , et al. June 3, 2 | 2014-06-03 |
Package-substrate-mounting printed wiring board and method for manufacturing the same Grant 8,692,129 - Kasai , et al. April 8, 2 | 2014-04-08 |
Printed Wiring Board And Method For Manufacturing The Same App 20140090878 - ADACHI; Takema | 2014-04-03 |
Printed Wiring Board App 20130240258 - ISHIDA; Naoto ;   et al. | 2013-09-19 |
Printed Wiring Board App 20130221518 - ISHIDA; Naoto ;   et al. | 2013-08-29 |
Method For Manufacturing Multilayer Printed Wiring Board App 20120246925 - Hibino; Toshiaki ;   et al. | 2012-10-04 |
Method For Manufacturing Multilayer Printed Wiring Board App 20120246924 - HIBINO; Toshiaki ;   et al. | 2012-10-04 |
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20120247813 - Ueda; Kazuyuki ;   et al. | 2012-10-04 |
Package-substrate-mounting Printed Wiring Board And Method For Manufacturing The Same App 20120247823 - KASAI; Toshiaki ;   et al. | 2012-10-04 |
Printed Wiring Board App 20120247818 - Adachi; Takema ;   et al. | 2012-10-04 |
Multilayer Printed Wiring Board And Method For Manufacturing Multilayer Printed Wiring Board App 20120229990 - ADACHI; Takema ;   et al. | 2012-09-13 |
Multilayer Printed Wiring Board App 20120199386 - Adachi; Takema ;   et al. | 2012-08-09 |
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