loadpatents
name:-0.03491997718811
name:-0.034449100494385
name:-0.020143032073975
ADACHI; Takema Patent Filings

ADACHI; Takema

Patent Applications and Registrations

Patent applications and USPTO patent grants for ADACHI; Takema.The latest application filed is for "wiring substrate and method for manufacturing wiring substrate".

Company Profile
19.30.38
  • ADACHI; Takema - Ogaki JP
  • ADACHI; Takema - Ogaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wiring Substrate And Method For Manufacturing Wiring Substrate
App 20220248533 - ADACHI; Takema ;   et al.
2022-08-04
Wiring Substrate And Method For Manufacturing Wiring Substrate
App 20220248531 - ADACHI; Takema ;   et al.
2022-08-04
Wiring Substrate And Method For Manufacturing Wiring Substrate
App 20220077046 - ADACHI; Takema ;   et al.
2022-03-10
Printed wiring board
Grant 10,645,819 - Furutani , et al.
2020-05-05
Method for manufacturing electronic component attached wiring board
Grant 10,477,699 - Adachi , et al. Nov
2019-11-12
Printed wiring board
Grant 10,440,823 - Adachi , et al. O
2019-10-08
Printed wiring board
Grant 10,405,426 - Adachi , et al. Sep
2019-09-03
Printed wiring board
Grant 10,375,828 - Adachi , et al.
2019-08-06
Printed wiring board
Grant 10,368,440 - Adachi , et al. July 30, 2
2019-07-30
Printed Wiring Board
App 20190215959 - ADACHI; Takema ;   et al.
2019-07-11
Printed Wiring Board
App 20190200462 - Furutani; Toshiki ;   et al.
2019-06-27
Printed wiring board
Grant 10,314,168 - Adachi , et al.
2019-06-04
Printed Wiring Board
App 20190124768 - ADACHI; Takema ;   et al.
2019-04-25
Printed Wiring Board
App 20190124767 - ADACHI; Takema ;   et al.
2019-04-25
Printed Wiring Board
App 20190124766 - ADACHI; Takema ;   et al.
2019-04-25
Printed Wiring Board
App 20190124765 - Adachi; Takema ;   et al.
2019-04-25
Shield cap and method for manufacturing the same
Grant 10,271,468 - Furutani , et al.
2019-04-23
Printed wiring board for mounting electronic component
Grant 10,231,336 - Furutani , et al.
2019-03-12
Shield cap and method for manufacturing the same
Grant 10,231,369 - Furutani , et al.
2019-03-12
Method for manufacturing wiring board with conductive post
Grant 10,221,497 - Noda , et al.
2019-03-05
Printed wiring board and method for manufacturing the same
Grant 10,219,383 - Kitagawa , et al. Feb
2019-02-26
Shield cap and method for manufacturing the same
Grant 10,194,569 - Furutani , et al. Ja
2019-01-29
Shield cap and method for manufacturing the same
Grant 10,182,518 - Furutani , et al. Ja
2019-01-15
Printed Wiring Board And Method For Manufacturing The Same
App 20180270958 - KITAGAWA; Katsutoshi ;   et al.
2018-09-20
Printed Wiring Board
App 20180270951 - Furutani; Toshiki ;   et al.
2018-09-20
Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same
Grant 10,070,523 - Sakai , et al. September 4, 2
2018-09-04
Printed wiring board
Grant 9,980,371 - Katsuno , et al. May 22, 2
2018-05-22
Shield Cap And Method For Manufacturing The Same
App 20180110161 - FURUTANI; Toshiki ;   et al.
2018-04-19
Shield Cap And Method For Manufacturing The Same
App 20180110159 - FURUTANI; Toshiki ;   et al.
2018-04-19
Shield Cap And Method For Manufacturing The Same
App 20180110164 - FURUTANI; Toshiki ;   et al.
2018-04-19
Shield Cap And Method For Manufacturing The Same
App 20180110163 - FURUTANI; Toshiki ;   et al.
2018-04-19
Interposer and circuit substrate
Grant 9,837,345 - Noda , et al. December 5, 2
2017-12-05
Method For Manufacturing Electronic Component Attached Wiring Board
App 20170257952 - ADACHI; Takema ;   et al.
2017-09-07
Printed Wiring Board And Semiconductor Package
App 20170053878 - KAJIHARA; Kazuki ;   et al.
2017-02-23
Printed Wiring Board, Semiconductor Package, And Method For Manufacturing Printed Wiring Board
App 20170033036 - KAJIHARA; Kazuki ;   et al.
2017-02-02
Interposer And Circuit Substrate
App 20170018494 - NODA; Kota ;   et al.
2017-01-19
Printed Wiring Board And Method For Manufacturing The Same
App 20160316558 - SAKAI; Shunsuke ;   et al.
2016-10-27
Printed Wiring Board And Method For Manufacturing The Same
App 20160295692 - ASANO; Koji ;   et al.
2016-10-06
Printed Wiring Board
App 20160242285 - Katsuno; Takayuki ;   et al.
2016-08-18
Method for manufacturing multilayer printed wiring board
Grant 9,420,708 - Hibino , et al. August 16, 2
2016-08-16
Combined substrate
Grant 9,401,320 - Daizo , et al. July 26, 2
2016-07-26
Printed Wiring Board
App 20160014898 - Adachi; Takema ;   et al.
2016-01-14
Printed wiring board
Grant 9,185,799 - Ishida , et al. November 10, 2
2015-11-10
Method For Manufacturing Wiring Board With Conductive Post
App 20150271929 - NODA; Kota ;   et al.
2015-09-24
Combined Substrate
App 20150255433 - DAIZO; Tomoya ;   et al.
2015-09-10
Printed wiring board and method for manufacturing the same
Grant 9,078,366 - Adachi July 7, 2
2015-07-07
Printed wiring board
Grant 9,048,229 - Ishida , et al. June 2, 2
2015-06-02
Printed Wiring Board With Metal Post And Method For Manufacturing Printed Wiring Board With Metal Post
App 20150077963 - ADACHI; Takema ;   et al.
2015-03-19
Printed Wiring Board
App 20150062849 - ADACHI; Takema ;   et al.
2015-03-05
Method for manufacturing multilayer printed wiring board
Grant 8,931,168 - Hibino , et al. January 13, 2
2015-01-13
Printed Wiring Board
App 20140246765 - ISHIDA; Naoto ;   et al.
2014-09-04
Printed wiring board and method for manufacturing printed wiring board
Grant 8,772,646 - Ueda , et al. July 8, 2
2014-07-08
Printed wiring board
Grant 8,742,553 - Ishida , et al. June 3, 2
2014-06-03
Package-substrate-mounting printed wiring board and method for manufacturing the same
Grant 8,692,129 - Kasai , et al. April 8, 2
2014-04-08
Printed Wiring Board And Method For Manufacturing The Same
App 20140090878 - ADACHI; Takema
2014-04-03
Printed Wiring Board
App 20130240258 - ISHIDA; Naoto ;   et al.
2013-09-19
Printed Wiring Board
App 20130221518 - ISHIDA; Naoto ;   et al.
2013-08-29
Method For Manufacturing Multilayer Printed Wiring Board
App 20120246925 - Hibino; Toshiaki ;   et al.
2012-10-04
Method For Manufacturing Multilayer Printed Wiring Board
App 20120246924 - HIBINO; Toshiaki ;   et al.
2012-10-04
Printed Wiring Board And Method For Manufacturing Printed Wiring Board
App 20120247813 - Ueda; Kazuyuki ;   et al.
2012-10-04
Package-substrate-mounting Printed Wiring Board And Method For Manufacturing The Same
App 20120247823 - KASAI; Toshiaki ;   et al.
2012-10-04
Printed Wiring Board
App 20120247818 - Adachi; Takema ;   et al.
2012-10-04
Multilayer Printed Wiring Board And Method For Manufacturing Multilayer Printed Wiring Board
App 20120229990 - ADACHI; Takema ;   et al.
2012-09-13
Multilayer Printed Wiring Board
App 20120199386 - Adachi; Takema ;   et al.
2012-08-09

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