Abys; Joseph A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Abys; Joseph A..The latest application filed is for "copper filling of through silicon vias".
Company Profile
6.39.40
- Abys; Joseph A. - Guilford CT US
- Abys; Joseph A. - Warren NJ US
- Abys; Joseph A. - Howell NJ
- Abys; Joseph A. - Bridgewater NJ
Patent Activity
| Patent | Date |
|---|---|
| Process for filling vias in the microelectronics Grant 10,541,140 - Richardson , et al. Ja | 2020-01-21 |
| Copper filling of through silicon vias Grant 10,221,496 - Richardson , et al. | 2019-03-05 |
| Copper Filling Of Through Silicon Vias App 20190003068 - Richardson; Thomas B. ; et al. | 2019-01-03 |
| Process for filling vias in the microelectronics Grant 10,103,029 - Richardson , et al. October 16, 2 | 2018-10-16 |
| Silver plating in electronics manufacture Grant 9,730,321 - Yau , et al. August 8, 2 | 2017-08-08 |
| Process for Filling Vias in the Microelectronics App 20160254156 - Richardson; Thomas B. ; et al. | 2016-09-01 |
| Adhesion Promotion in Printed Circuit Boards App 20160234947 - Owei; Abayomi I. ; et al. | 2016-08-11 |
| Adhesion promotion in printed circuit boards Grant 9,338,896 - Owei , et al. May 10, 2 | 2016-05-10 |
| Electrodeposition Of Silver With Fluoropolymer Nanoparticles App 20160032479 - Li; Jingye ; et al. | 2016-02-04 |
| Electrolytic deposition of metal-based composite coatings comprising nano-particles Grant 9,217,205 - Abys , et al. December 22, 2 | 2015-12-22 |
| Immersion tin silver plating in electronics manufacture Grant 9,175,400 - Yau , et al. November 3, 2 | 2015-11-03 |
| Silver Plating In Electronics Manufacture App 20150257264 - Yau; Yung-Herng ; et al. | 2015-09-10 |
| Silver plating in electronics manufacture Grant 8,986,434 - Yau , et al. March 24, 2 | 2015-03-24 |
| Composite coatings for whisker reduction Grant 8,906,217 - Abys , et al. December 9, 2 | 2014-12-09 |
| Metallic surface enhancement Grant 8,741,390 - Abys , et al. June 3, 2 | 2014-06-03 |
| Process For Filling Vias In The Microelectronics App 20140120722 - Richardson; Thomas B. ; et al. | 2014-05-01 |
| Anti-tarnish coatings Grant 8,703,243 - Abys , et al. April 22, 2 | 2014-04-22 |
| Adhesion Promotion In Printed Circuit Boards App 20140030425 - OWEI; Abayomi I. ; et al. | 2014-01-30 |
| Copper Filling Of Through Silicon Vias App 20130199935 - Richardson; Thomas B. ; et al. | 2013-08-08 |
| Silver Plating In Electronics Manufacture App 20130180768 - Yau; Yung-Herng ; et al. | 2013-07-18 |
| Silver plating in electronics manufacture Grant 8,349,393 - Yau , et al. January 8, 2 | 2013-01-08 |
| Self assembled molecules on immersion silver coatings Grant 8,323,741 - Abys , et al. December 4, 2 | 2012-12-04 |
| Composite Coatings For Whisker Reduction App 20120285834 - Abys; Joseph A. ; et al. | 2012-11-15 |
| Self Assembled Molecules On Immersion Silver Coatings App 20120276409 - Abys; Joseph A. ; et al. | 2012-11-01 |
| Composite coatings for whisker reduction Grant 8,226,807 - Abys , et al. July 24, 2 | 2012-07-24 |
| Anti-tarnish Coatings App 20120175022 - Abys; Joseph A. ; et al. | 2012-07-12 |
| Self assembled molecules on immersion silver coatings Grant 8,216,645 - Abys , et al. July 10, 2 | 2012-07-10 |
| Adhesion Promotion Of Metal To Laminate With Multi-functional Molecular System App 20120168075 - Abys; Joseph A. ; et al. | 2012-07-05 |
| Surface preparation process for damascene copper deposition Grant 7,998,859 - Chen , et al. August 16, 2 | 2011-08-16 |
| Anti-tarnish coatings Grant 7,972,655 - Abys , et al. July 5, 2 | 2011-07-05 |
| Immersion Tin Silver Plating In Electronics Manufacture App 20110097597 - Yau; Yung-Herng ; et al. | 2011-04-28 |
| Metallic surface enhancement Grant 7,883,738 - Abys , et al. February 8, 2 | 2011-02-08 |
| Corrosion Protection Of Bronzes App 20100319572 - Abys; Joseph A. ; et al. | 2010-12-23 |
| Electrolytic Deposition Of Metal-based Composite Coatings Comprising Nano-particles App 20100294669 - Abys; Joseph A. ; et al. | 2010-11-25 |
| Anti-tarnish Coatings App 20100291303 - Abys; Joseph A. ; et al. | 2010-11-18 |
| Organic solderability preservative comprising high boiling temperature alcohol Grant 7,794,531 - Abys , et al. September 14, 2 | 2010-09-14 |
| Metallic Surface Enhancement App 20100151263 - Abys; Joseph A. ; et al. | 2010-06-17 |
| Tin-silver solder bumping in electronics manufacture Grant 7,713,859 - Richardson , et al. May 11, 2 | 2010-05-11 |
| Copper metallization of through silicon via Grant 7,670,950 - Richardson , et al. March 2, 2 | 2010-03-02 |
| Composite Coatings For Whisker Reduction App 20090145765 - Abys; Joseph A. ; et al. | 2009-06-11 |
| Composite Coatings For Whisker Reduction App 20090145764 - Abys; Joseph A. ; et al. | 2009-06-11 |
| Self Assembled Molecules On Immersion Silver Coatings App 20090121192 - Abys; Joseph A. ; et al. | 2009-05-14 |
| Copper Metallization Of Through Silicon Via App 20090035940 - Richardson; Thomas B. ; et al. | 2009-02-05 |
| Corrosion Protection Of Bronzes App 20080314283 - Abys; Joseph A. ; et al. | 2008-12-25 |
| Metallic Surface Enhancement App 20080261025 - Abys; Joseph A. ; et al. | 2008-10-23 |
| Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components App 20080261071 - Xu; Chen ; et al. | 2008-10-23 |
| Organic Solderability Preservative Comprising High Boiling Temperature Alcohol App 20080163787 - Abys; Joseph A. ; et al. | 2008-07-10 |
| Tin-silver Solder Bumping In Electronics Manufacture App 20070037377 - Richardson; Thomas B. ; et al. | 2007-02-15 |
| Cobalt self-initiated electroless via fill for stacked memory cells App 20060188659 - Chen; Qingyun ; et al. | 2006-08-24 |
| Silver plating in electronics manufacture App 20060024430 - Yau; Yung-Herng ; et al. | 2006-02-02 |
| Corrosion resistance enhancement of tin surfaces App 20050268991 - Fan, Chonglun ; et al. | 2005-12-08 |
| Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components App 20050249969 - Xu, Chen ; et al. | 2005-11-10 |
| Whisker inhibition in tin surfaces of electronic components App 20050249968 - Xu, Chen ; et al. | 2005-11-10 |
| Solder electroplating bath including brighteners having reduced volatility Grant 6,730,209 - Abys , et al. May 4, 2 | 2004-05-04 |
| Solder electroplating bath including brighteners having reduced volatility App 20030159939 - Abys, Joseph A. ; et al. | 2003-08-28 |
| Multi-purpose finish for printed wiring boards and method of manufacture of such boards Grant 6,534,192 - Abys , et al. March 18, 2 | 2003-03-18 |
| Method of manufacture of printed wiring boards having multi-purpose finish Grant 6,517,893 - Abys , et al. February 11, 2 | 2003-02-11 |
| Metal article coated with tin or tin alloy under tensile stress to inhibit whisker growth App 20030025182 - Abys, Joseph A. ; et al. | 2003-02-06 |
| Method of determining the quality of hard gold App 20020196436 - Abys, Joseph A. ; et al. | 2002-12-26 |
| Multi-purpose finish for printed wiring boards and method of manufacture of such boards App 20020015782 - Abys, Joseph A. ; et al. | 2002-02-07 |
| Hydrodynamically modulated hull cell Grant 5,413,692 - Abys , et al. * May 9, 1 | 1995-05-09 |
| Thermal annealing of palladium alloys Grant 5,180,482 - Abys , et al. January 19, 1 | 1993-01-19 |
| Acidic palladium strike bath Grant 5,178,745 - Abys , et al. January 12, 1 | 1993-01-12 |
| Palladium alloy plating process Grant 4,911,798 - Abys , et al. March 27, 1 | 1990-03-27 |
| Silver plating procedure Grant 4,478,691 - Abys October 23, 1 | 1984-10-23 |
| Process for electroplating palladium Grant 4,468,296 - Abys , et al. August 28, 1 | 1984-08-28 |
| Electroless palladium process Grant 4,424,241 - Abys January 3, 1 | 1984-01-03 |
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