ABLEPRINT TECHNOLOGY CO., LTD.
Patent Applications and Registrations
Patent applications and USPTO patent grants for ABLEPRINT TECHNOLOGY CO., LTD..The latest application filed is for "method for suppressing material warpage by increasing gas density".
- ABLEPRINT TECHNOLOGY CO., LTD. - Miaoli County TW
- Ableprint Technology Co., Ltd. - Hsinchu TW
- ABLEPRINT TECHNOLOGY CO., LTD. - HSINCHU CITY TW
- ABLEPRINT TECHNOLOGY CO., LTD. - HSINCHU CITY 300 TW
Trademarks
| Patent | Date |
|---|---|
| Method For Suppressing Material Warpage By Increasing Gas Density App 20220246482 - Horng; Chih-Horng | 2022-08-04 |
| Device and method for chip pressing Grant 9,196,600 - Horng November 24, 2 | 2015-11-24 |
| Flip chip package manufacturing method Grant 8,936,968 - Horng January 20, 2 | 2015-01-20 |
| Method for securing a carrier by gas pressurization to inhibit warpage of the carrier Grant 8,893,378 - Horng November 25, 2 | 2014-11-25 |
| Gas concentration control device for pressure vessel Grant 8,695,623 - Horng April 15, 2 | 2014-04-15 |
| Solder Spattering Suppressed Reflow Method App 20130119119 - HORNG; HORNG CHIH | 2013-05-16 |
| Flip Chip Package Manufacturing Method App 20130065362 - HORNG; HORNG CHIH | 2013-03-14 |
| Gas Concentration Control Device For Pressure Vessel App 20130037126 - HORNG; HORNG CHIH | 2013-02-14 |
| Method for removing bubbles from adhesive layer of semiconductor chip package Grant 7,863,094 - Hung , et al. January 4, 2 | 2011-01-04 |
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