Abinan; Rachel Layda

Patent Applications and Registrations

Patent applications and USPTO patent grants for Abinan; Rachel Layda.The latest application filed is for "integrated circuit packaging system with interconnects and method of manufacture thereof".

Company Profile

0.10.7

Abinan; Rachel Layda - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit package system with bonding in via Grant 9,000,579 - Shim , et al. April 7, 2	2015-04-07
Integrated circuit packaging system with interconnects and method of manufacture thereof Grant 8,802,555 - Bathan , et al. August 12, 2	2014-08-12
Integrated circuit package system with heatspreader Grant 8,395,254 - Espiritu , et al. March 12, 2	2013-03-12
Integrated Circuit Packaging System With Interconnects And Method Of Manufacture Thereof App 20120241931 - Bathan; Henry Descalzo ; et al.	2012-09-27
Integrated circuit package system having interconnect stack and external interconnect Grant 8,138,080 - Filoteo, Jr. , et al. March 20, 2	2012-03-20
Stacked integrated circuits package system with passive components Grant 8,026,129 - Cablao , et al. September 27, 2	2011-09-27
Integrated circuit packaging system with interposer Grant 7,911,046 - Cablao , et al. March 22, 2	2011-03-22
Integrated Circuit Packaging System With Interposer App 20090152704 - Cablao; Philip Lyndon ; et al.	2009-06-18
Integrated circuit packaging system with interposer Grant 7,518,226 - Cablao , et al. April 14, 2	2009-04-14
Integrated Circuit Package System With Bonding In Via App 20080237873 - Shim; Il Kwon ; et al.	2008-10-02
Integrated Circuit Packaging System With Interposer App 20080185719 - Cablao; Philip Lyndon ; et al.	2008-08-07
Integrated Circuit Package System With Heatspreader App 20070235859 - Espiritu; Emmanuel ; et al.	2007-10-11
Stacked Integrated Circuits Package System With Passive Components App 20070210432 - Cablao; Philip Lyndon ; et al.	2007-09-13
Integrated Circuit Package System App 20070210436 - Filoteo; Dario S. JR. ; et al.	2007-09-13

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