loadpatents
name:-0.012801885604858
name:-0.0093460083007812
name:-0.0026130676269531
Abe; Ryuichiro Patent Filings

Abe; Ryuichiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Abe; Ryuichiro.The latest application filed is for "magnetic sensor and method for manufacturing said magnetic sensor".

Company Profile
2.8.10
  • Abe; Ryuichiro - Kariya JP
  • ABE; Ryuichiro - Kariya-city JP
  • Abe; Ryuichiro - Ichinomiya JP
  • Abe; Ryuichiro - Ichinomiya-city JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Magnetic sensor and method for manufacturing said magnetic sensor
Grant 10,901,049 - Furuichi , et al. January 26, 2
2021-01-26
Magnetic Sensor And Method For Manufacturing Said Magnetic Sensor
App 20190242957 - FURUICHI; Takamoto ;   et al.
2019-08-08
Semiconductor sensor and manufacturing method therefor
Grant 7,770,452 - Sakai , et al. August 10, 2
2010-08-10
Semiconductor device having impurity-doped resistor element
Grant 7,670,918 - Fukami , et al. March 2, 2
2010-03-02
Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip
Grant 7,615,832 - Kondoh , et al. November 10, 2
2009-11-10
Sensor device
Grant 7,541,574 - Ninomiya , et al. June 2, 2
2009-06-02
Packaging method
Grant 7,470,996 - Yoneyama , et al. December 30, 2
2008-12-30
Semiconductor sensor and manufacturing method therefor
App 20080196501 - Sakai; Minekazu ;   et al.
2008-08-21
Semiconductor device having impurity-doped resistor element
App 20080188027 - Fukami; Yuko ;   et al.
2008-08-07
Semiconductor sensor and manufacturing method therefor
Grant 7,373,821 - Sakai , et al. May 20, 2
2008-05-20
Sensor device
Grant 7,327,004 - Hattori , et al. February 5, 2
2008-02-05
Sensor device
App 20070284713 - Ninomiya; Yasunori ;   et al.
2007-12-13
Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip
App 20070235825 - Kondoh; Ichiharu ;   et al.
2007-10-11
Sensor having semiconductor chip and circuit chip
App 20070090536 - Sakai; Minekazu ;   et al.
2007-04-26
Packaging method
App 20070023483 - Yoneyama; Takao ;   et al.
2007-02-01
Semiconductor sensor and manufacturing mehtod therefor
App 20070007607 - Sakai; Minekazu ;   et al.
2007-01-11
Sensor device
App 20060097331 - Hattori; Koji ;   et al.
2006-05-11
Diode and producing method thereof
App 20040016971 - Abe, Ryuichiro ;   et al.
2004-01-29

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