Abe; Norihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Abe; Norihiro.The latest application filed is for "varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg".

Company Profile

0.6.6

Abe; Norihiro - Shimodate JP
Abe; Norihiro - Shimodate-shi JP
Abe, Norihiro - Tokyo JP
Abe, Norihiro - Ibaraki JP
Abe; Norihiro - Tochigi JP
Abe; Norihiro - Utsunomiya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin Grant 7,538,150 - Oohori , et al. May 26, 2	2009-05-26
Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg Grant 7,390,571 - Hirai , et al. June 24, 2	2008-06-24
Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg App 20060141262 - Hirai; Yasuyuki ; et al.	2006-06-29
Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg Grant 7,041,399 - Hirai , et al. May 9, 2	2006-05-09
Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same App 20060008632 - Oohori; Kenichi ; et al.	2006-01-12
Stairway App 20050097835 - Nishimoto, Tsuyoshi ; et al.	2005-05-12
Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith App 20040076805 - Oohori, Kenichi ; et al.	2004-04-22
Resin composition, and use and method for preparing the same Grant 6,720,077 - Hirai , et al. April 13, 2	2004-04-13
Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg App 20040034129 - Hirai, Yasuyuki ; et al.	2004-02-19
Resin composition, and use and method for preparing the same App 20020155298 - Hirai, Yasuyuki ; et al.	2002-10-24
Absorbent article Grant 5,126,201 - Shiba , et al. June 30, 1	1992-06-30
Absorbent member Grant 4,835,042 - Dohzono , et al. May 30, 1	1989-05-30

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