| Patent | Date |
|---|
Method of producing electroconductive substrate, electronic device and display device
Grant 11,410,855 - Daitoku , et al. August 9, 2 | 2022-08-09 |
Electroconductive Substrate, Electronic Device And Display Device
App 20210265256 - DAITOKU; Takashi ; et al. | 2021-08-26 |
Electroconductive substrate, electronic device and display device
Grant 11,031,330 - Daitoku , et al. June 8, 2 | 2021-06-08 |
Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor
Grant 10,968,519 - Orikasa , et al. April 6, 2 | 2021-04-06 |
Sheet Material, Metal Mesh, Wiring Substrate, Display Device And Manufacturing Methods Therefor
App 20210087692 - ORIKASA; Makoto ; et al. | 2021-03-25 |
Electroconductive substrate, electronic device and display device
Grant 10,867,898 - Daitoku , et al. December 15, 2 | 2020-12-15 |
Method Of Producing Electroconductive Substrate, Electronic Device And Display Device
App 20200381266 - DAITOKU; Takashi ; et al. | 2020-12-03 |
Method of producing electroconductive substrate, electronic device and display device
Grant 10,784,122 - Daitoku , et al. Sept | 2020-09-22 |
Electroconductive Substrate, Electronic Device And Display Device
App 20200211951 - DAITOKU; Takashi ; et al. | 2020-07-02 |
Coating electronic component
Grant 10,392,704 - Yoshida , et al. A | 2019-08-27 |
Wiring component
Grant 10,374,301 - Horikawa , et al. | 2019-08-06 |
Lead-free solder and electronic component built-in module
Grant 10,362,686 - Yasui , et al. | 2019-07-23 |
Method for producing semiconductor chip
Grant 10,354,973 - Orikasa , et al. July 16, 2 | 2019-07-16 |
Method for manufacturing planar coil
Grant 10,354,796 - Horikawa , et al. July 16, 2 | 2019-07-16 |
Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof
Grant 10,304,779 - Orikasa , et al. | 2019-05-28 |
Junction structure for an electronic device and electronic device
Grant 10,205,250 - Yoshida , et al. Feb | 2019-02-12 |
Method Of Producing Electroconductive Substrate, Electronic Device And Display Device
App 20190043736 - DAITOKU; Takashi ; et al. | 2019-02-07 |
Sheet Material, Metal Mesh, Wiring Substrate, Display Device And Manufacturing Methods Therefor
App 20190032219 - ORIKASA; Makoto ; et al. | 2019-01-31 |
Sheet Material, Metal Mesh And Method For Manufacturing Thereof
App 20190032221 - ORIKASA; Makoto ; et al. | 2019-01-31 |
Electroconductive Substrate, Electronic Device And Display Device
App 20190035719 - DAITOKU; Takashi ; et al. | 2019-01-31 |
Method For Producing Semiconductor Chip
App 20190013293 - ORIKASA; Makoto ; et al. | 2019-01-10 |
Method for producing semiconductor package
Grant 10,163,847 - Orikasa , et al. Dec | 2018-12-25 |
Method For Producing Semiconductor Package
App 20180254255 - ORIKASA; Makoto ; et al. | 2018-09-06 |
Wiring Component
App 20180175494 - Horikawa; Yuhei ; et al. | 2018-06-21 |
Method For Manufacturing Planar Coil
App 20180174748 - Horikawa; Yuhei ; et al. | 2018-06-21 |
Microphone for wireless communications device
Grant D816,639 - Abe May 1, 2 | 2018-05-01 |
Electronic Component Module And Manufacturing Method Thereof
App 20180114759 - ORIKASA; Makoto ; et al. | 2018-04-26 |
Method for producing semiconductor package
Grant 9,818,736 - Orikasa , et al. November 14, 2 | 2017-11-14 |
Semiconductor package and manufacturing method therefor
Grant 9,768,154 - Tomonari , et al. September 19, 2 | 2017-09-19 |
Portable wireless communication device
Grant D796,467 - Oikawa , et al. September 5, 2 | 2017-09-05 |
Coating And Electronic Component
App 20170130337 - YOSHIDA; Kenichi ; et al. | 2017-05-11 |
Magnetic head device
Grant 9,620,156 - Igarashi , et al. April 11, 2 | 2017-04-11 |
Semiconductor Package And Manufacturing Method Therefor
App 20170092633 - Tomonari; Toshio ; et al. | 2017-03-30 |
Rectifying component for magnetic disk device
Grant 9,564,179 - Taniguchi , et al. February 7, 2 | 2017-02-07 |
Rectifying Component For Magnetic Disk Device
App 20160293226 - TANIGUCHI; Susumu ; et al. | 2016-10-06 |
Magnetic Head Device
App 20160275976 - IGARASHI; Katsuhiko ; et al. | 2016-09-22 |
Electronic circuit module component
Grant 9,320,146 - Yanagida , et al. April 19, 2 | 2016-04-19 |
Electronic component module
Grant 9,293,421 - Yanagida , et al. March 22, 2 | 2016-03-22 |
Terminal structure, and semiconductor element and module substrate comprising the same
Grant 9,257,402 - Yoshida , et al. February 9, 2 | 2016-02-09 |
Lead-free solder and electronic component built-in module
Grant 9,258,905 - Yasui , et al. February 9, 2 | 2016-02-09 |
Lead-free Solder And Electronic Component Built-in Module
App 20160008930 - YASUI; Tsutomu ; et al. | 2016-01-14 |
Electronic component
Grant 9,144,166 - Yanagida , et al. September 22, 2 | 2015-09-22 |
Electronic Component Module
App 20150255401 - YANAGIDA; Miyuki ; et al. | 2015-09-10 |
Terminal structure and semiconductor device
Grant 9,070,606 - Yoshida , et al. June 30, 2 | 2015-06-30 |
Terminal structure, and semiconductor element and module substrate comprising the same
Grant 8,970,037 - Yoshida , et al. March 3, 2 | 2015-03-03 |
Junction Structure For An Electronic Device And Electronic Device
App 20140291021 - YOSHIDA; Kenichi ; et al. | 2014-10-02 |
Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure
Grant 8,787,028 - Horikawa , et al. July 22, 2 | 2014-07-22 |
Terminal Structure And Semiconductor Device
App 20140054768 - YOSHIDA; Kenichi ; et al. | 2014-02-27 |
Terminal Structure And Semiconductor Device
App 20140054767 - YOSHIDA; Kenichi ; et al. | 2014-02-27 |
Terminal Structure, And Semiconductor Element And Module Substrate Comprising The Same
App 20140054770 - YOSHIDA; Kenichi ; et al. | 2014-02-27 |
Terminal Structure, And Semiconductor Element And Module Substrate Comprising The Same
App 20140054769 - YOSHIDA; Kenichi ; et al. | 2014-02-27 |
Electronic Circuit Module Component
App 20140041913 - YANAGIDA; Miyuki ; et al. | 2014-02-13 |
Electronic Component
App 20140041930 - YANAGIDA; Miyuki ; et al. | 2014-02-13 |
Ceramic electronic component
Grant 8,553,390 - Taniguchi , et al. October 8, 2 | 2013-10-08 |
Terminal Structure, Printed Circuit Board, Module Board, Electronic Device, And Method For Manufacturing Terminal Structure
App 20130135834 - Horikawa; Yuhei ; et al. | 2013-05-30 |
Rare-earth sintered magnet containing a nitride, rotator containing rare-earth sintered magnet, and reciprocating motor containing rare-earth sintered magnet
Grant 8,449,696 - Yoshida , et al. May 28, 2 | 2013-05-28 |
Terminal structure, printed wiring board, module substrate, and electronic device
Grant 8,383,964 - Sato , et al. February 26, 2 | 2013-02-26 |
Method for manufacturing electronic component
Grant 8,291,585 - Onodera , et al. October 23, 2 | 2012-10-23 |
Ceramic electronic component and method for producing same
Grant 8,254,083 - Sakurai , et al. August 28, 2 | 2012-08-28 |
Plating film, printed wiring board, and module substrate
Grant 8,183,463 - Sato , et al. May 22, 2 | 2012-05-22 |
Coating And Electronic Component
App 20120018191 - YOSHIDA; Kenichi ; et al. | 2012-01-26 |
Ceramic Electronic Component
App 20120007709 - Taniguchi; Susumu ; et al. | 2012-01-12 |
Ceramic Electronic Component And Method For Manufacturing The Same
App 20110317328 - TANIGUCHI; Susumu ; et al. | 2011-12-29 |
Rare-earth Sintered Magnet, Rotator, And Reciprocating Motor
App 20110227424 - YOSHIDA; Kenichi ; et al. | 2011-09-22 |
Radio two-way communications device
Grant D644,621 - Abe September 6, 2 | 2011-09-06 |
Stacked electronic part and method of manufacturing the same
Grant 8,009,012 - Kajino , et al. August 30, 2 | 2011-08-30 |
Lead-free Solder And Electronic Component Built-in Module
App 20110182041 - YASUI; Tsutomu ; et al. | 2011-07-28 |
Method For Producing Covered Particles
App 20110171378 - Masaoka; Raitaro ; et al. | 2011-07-14 |
Terminal Structure, Printed Wiring Board, Module Substrate, And Electronic Device
App 20110056744 - Sato; Atsushi ; et al. | 2011-03-10 |
Ceramic Electronic Component And Method For Producing Same
App 20110051314 - SAKURAI; Takashi ; et al. | 2011-03-03 |
Plating Film, Printed Wiring Board, And Module Substrate
App 20110048774 - SATO; Atsushi ; et al. | 2011-03-03 |
Multilayer substrate and manufacturing method thereof
Grant 7,868,464 - Kawabata , et al. January 11, 2 | 2011-01-11 |
Ceramic Electronic Part
App 20100202098 - YANAGIDA; Miyuki ; et al. | 2010-08-12 |
Semiconductor IC and Its Manufacturing Method, and Module with Embedded Semiconductor IC and Its Manufacturing Method
App 20100178737 - KAWABATA; Kenichi ; et al. | 2010-07-15 |
Module with embedded semiconductor IC and method of fabricating the module
Grant 7,547,975 - Takaya , et al. June 16, 2 | 2009-06-16 |
Method For Manufacturing Electronic Component
App 20090053853 - Onodera; Ko ; et al. | 2009-02-26 |
Stacked electronic part and method of manufacturing the same
App 20090027158 - Kajino; Takashi ; et al. | 2009-01-29 |
Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method
App 20060273451 - Kawabata; Kenichi ; et al. | 2006-12-07 |
Multilayer substrate and manufacturing method thereof
App 20060057341 - Kawabata; Kenichi ; et al. | 2006-03-16 |
Soldering flux, solder paste and method of soldering
Grant 6,915,944 - Takaya , et al. July 12, 2 | 2005-07-12 |
Module with embedded semiconductor IC and method of fabricating the module
App 20050029642 - Takaya, Minoru ; et al. | 2005-02-10 |
Thermosetting soldering flux and soldering process
Grant 6,402,013 - Abe , et al. June 11, 2 | 2002-06-11 |
Thermosetting soldering flux and soldering process
App 20010019075 - Abe, Hisayuki ; et al. | 2001-09-06 |
Multilayer electronic part with planar terminal electrodes
Grant 6,147,573 - Kumagai , et al. November 14, 2 | 2000-11-14 |
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