Abatake; Jun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Abatake; Jun.The latest application filed is for "saw filter manufacturing method and saw filter".
- Abatake; Jun - Tokyo JP
- Abatake; Jun - Ota-ku N/A JP
| Patent | Date |
|---|---|
| Method of manufacturing substrate for acoustic wave device Grant 11,165,408 - Abatake , et al. November 2, 2 | 2021-11-02 |
| Saw filter manufacturing method and saw filter Grant 11,088,674 - Abatake , et al. August 10, 2 | 2021-08-10 |
| Saw Filter Manufacturing Method And Saw Filter App 20200343878 - ABATAKE; Jun ; et al. | 2020-10-29 |
| Method Of Manufacturing Substrate For Acoustic Wave Device App 20190044494 - Abatake; Jun ; et al. | 2019-02-07 |
| BAW device and method of manufacturing BAW device Grant 10,050,599 - Abatake August 14, 2 | 2018-08-14 |
| Baw Device And Baw Device Manufacturing Method App 20170257075 - Abatake; Jun | 2017-09-07 |
| Baw Device And Method Of Manufacturing Baw Device App 20170063334 - Abatake; Jun | 2017-03-02 |
| Saw Device Manufacturing Method App 20160380605 - Matsumoto; Hirokazu ; et al. | 2016-12-29 |
| Wafer dividing apparatus and laser processing apparatus Grant 8,642,920 - Aikawa , et al. February 4, 2 | 2014-02-04 |
| Wafer dividing method Grant 8,415,234 - Abatake April 9, 2 | 2013-04-09 |
| Wafer Dividing Method App 20120289028 - Abatake; Jun | 2012-11-15 |
| Mems Device Manufacturing Method App 20110230000 - Abatake; Jun | 2011-09-22 |
| Wafer Dividing Apparatus And Laser Processing Apparatus App 20110147349 - Aikawa; Chikara ; et al. | 2011-06-23 |
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