58th Research Institute of China Electronics Technology Group Corporation
Patent Applications and Registrations
Patent applications and USPTO patent grants for 58th Research Institute of China Electronics Technology Group Corporation.The latest application filed is for "interconnected dies, interconnected microcomponents, interconnected microsystems and their communication methods".
- 58th Research Institute of China Electronics Technology Group Corporation - Wuxi, Jiangsu CN
- The 58th Research Institute of China Electronics Technology Group Corporation - Wuxi Jiangsu CN
| Patent | Date |
|---|---|
| Data Transmission Event Used For Interconnected Dies App 20220276973 - Wei; Jinghe ; et al. | 2022-09-01 |
| Communication Method And Its System Between Interconnected Die And Dsp/fpga App 20220276306 - Wei; Jinghe ; et al. | 2022-09-01 |
| An Inter-Die High-Speed Expansion System And An Expansion Method Thereof App 20220276677 - Wei; Jinghe ; et al. | 2022-09-01 |
| The Clock Domain System of Interconnected Dies and Its Management Methods App 20220276671 - Wei; Jinghe ; et al. | 2022-09-01 |
| Interface System For Interconnected Die And Mpu And Communication Method Thereof App 20220276304 - Wei; Jinghe ; et al. | 2022-09-01 |
| Interconnected Dies, Interconnected Microcomponents, Interconnected Microsystems and Their Communication Methods App 20220276982 - Wei; Jinghe ; et al. | 2022-09-01 |
| Multi-channel high-precision ADC circuit with self-calibration of mismatch error Grant 10,742,226 - Chen , et al. A | 2020-08-11 |
| Fan-out wafer level multilayer wiring package structure Grant 10,580,755 - Ji , et al. | 2020-03-03 |
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