The mark consists of two stylized non-Latin characters.
Mark For: This trademark registration is intended to cover the categories of crystal wafer etching treatment; Integrated circuit etching treatment; Semiconductor sealing processing; Wafer Foundry; Custom manufacture of semiconductors for others; Manufacture and assembly of automotive semiconductors according to customer's specifications and instructions; Manufacturing and assembling services for automotive wafers according to customer's specifications and instructions; Services of manufacturing and assembling semiconductors and integrated circuits according to customer specifications; Manufacturing silicon wafers and integrated circuits according to customer instructions; Assembly services of silicon wafers and integrated circuits; Polishing services for silicon wafers and semiconductors; Assembling integrated circuits, photomasks and electronic or computer chips for others; Foundry services of semiconductors and integrated circuits; Semiconductor and integrated circuit packaging processing; Foundry semiconductor chip cutting and packaging processing services; Wafer etching and dicing processing; Etching processing; Cutting or forming of integrated circuits; Manufacturing and processing of integrated circuits.
Status
2023-03-18 UTC
LIVE APPLICATION Awaiting Examination
The trademark application has been accepted by the Office (has met the minimum filing requirements) and has not yet been assigned to an examiner.
Chinese characters; Japanese and Chinese characters; Japanese characters
Attorney of Record
ANGEL ROMAN CAMPOS MUNCY, GEISSLER, OLDS & LOWE, P.C. 125 S. ROYAL ST., ALEXANDRIA, VA 22314
Good, Services, and Codes
International Codes:
40
U.S. Codes:
100,103,106
Type Code
Type
GS0401
Crystal wafer etching treatment; Integrated circuit etching treatment; Semiconductor sealing processing; Wafer Foundry; Custom manufacture of semiconductors for others; Manufacture and assembly of automotive semiconductors according to customer's specifications and instructions; Manufacturing and assembling services for automotive wafers according to customer's specifications and instructions; Services of manufacturing and assembling semiconductors and integrated circuits according to customer specifications; Manufacturing silicon wafers and integrated circuits according to customer instructions; Assembly services of silicon wafers and integrated circuits; Polishing services for silicon wafers and semiconductors; Assembling integrated circuits, photomasks and electronic or computer chips for others; Foundry services of semiconductors and integrated circuits; Semiconductor and integrated circuit packaging processing; Foundry semiconductor chip cutting and packaging processing services; Wafer etching and dicing processing; Etching processing; Cutting or forming of integrated circuits; Manufacturing and processing of integrated circuits
Trademark Filing History
Description
Date
Proceeding Number
NEW APPLICATION ENTERED
2023-03-18
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