Trademark Filing

The mark consists of a banner.

Mark For: This trademark registration is intended to cover the categories of hydraulic fluids; lubricants; pressure compensating fluids; motion compensating fluids; hydraulic fluids for subsea production control systems; well control fluids; subsea blowout preventer control fluids; surface blowout preventer control fluids; chemicals used in the oil and gas, exploration and production industry. Industrial chemicals for use in plating, cleaning and etching metal and plastic surfaces; chemicals for use in the manufacture of commercial and industrial printing plates, namely polymer compositions. Chemicals for use in electroless plating and electroplating processes; chemical compositions for metal plating; pre-treatment preparations for plating; trivalent chromate finishing and coating preparations for plating; metal chlorides; chemicals for use in semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; electroplating chemicals; chemicals for wafer level semiconductor packaging processes; chemicals for panel level semiconductor packaging processes; chemicals for fan out wafer level semiconductor packaging processes; chemicals for fan out panel level semiconductor packaging processes; chemicals for use in the circuit board industry, namely, peroxide and sulfuric acid based etchants and oxidants for roughening or etching copper surfaces prior to multilayer lamination of printed wiring boards; chemicals used in industry; Adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; Chemicals, namely, soldering flux; industrial chemicals used for cleaning circuit boards and surface mount devices; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry. Chemicals used in the cleaning, etching and plating of metals and non-metal substrates; chemicals used in the production of printed circuit boards and semiconductor materials. Industrial chemicals; chemical preparations for scientific use (other than for medical or veterinary use); chemicals for laboratory analyses (other than for medical or veterinary use); chemical reagents (other than for medical or veterinary use); compositions for chemically modifying metal and nonmetal products; chemical used in activating, acidification, coating, drying, retouching and altering metal and nonmetal products; chemicals used for separating chromium compounds from aqueous solutions.

Status

2022-08-08 UTC
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LIVE APPLICATION Awaiting Examination

Research	OneLook Acronym Finder
Serial Number	97534812
Mark Literal Elements	None
Mark Drawing Type	-
Mark Type	Trademark
Standard Character Claim	No
Current Location	NEW APPLICATION PROCESSING 2022-08-08
Basis	1(b)
Class Status	ACTIVE
Primary US Classes	001: Raw or Partly Prepared Materials 005: Adhesives 006: Chemicals and Chemical Compositions 010: Fertilizers 026: Measuring and Scientific Appliances 046: Foods and Ingredients of Foods
Primary International Class	001 - Primary Class (Chemicals) Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
Filed Use	No
Current Use	No
Intent To Use	Yes
Filed ITU	Yes
44D Filed	No
44E Current	No
66A Current	No
Current Basis	No
No Basis	No
Attorney Name	Fatima Lahnin
Attorney Docket Number	33911-T02 SH

Timeline