VIA DEP
MacDermid, Incorporated
Mark For: VIA DEP® trademark registration is intended to cover the categories of
| Research |
OneLook
Acronym Finder
|
| Serial Number | 97252047 |
| Registration Number | 6859492 |
| Mark Literal Elements | VIA DEP |
| Mark Drawing Type | 4 - STANDARD CHARACTER MARK |
| Mark Type | TRADEMARK |
| Register | PRINCIPAL |
| Current Location | NEW APPLICATION PROCESSING 2022-02-08 |
| Basis | 1(a) |
| Class Status | ACTIVE |
| Primary US Classes |
|
| Primary International Class |
|
| Filed Use | Yes |
| Current Use | Yes |
| Intent To Use | No |
| Filed ITU | No |
| 44D Filed | No |
| 44E Current | No |
| 66A Current | No |
| Current Basis | No |
| No Basis | No |
| Attorney Name | Fatima Lahnin |
| Attorney Docket Number | 33223-T06-ES |
Timeline
| 2007-12-31 | Date of First Use |
| 2007-12-31 | Date of Use In Commerce |
| 2022-02-03 | Application Filed |
| 2022-02-07 | Location: NEW APPLICATION PROCESSING |
| 2022-02-07 | Status: Live/Pending |
| 2022-02-07 | Transaction Date |
| 2022-02-08 | Location: NEW APPLICATION PROCESSING |
| 2022-02-08 | Status: New application will be assigned to an examining attorney approximately 6 months after filing date. |
| 2022-09-27 | Trademark Registered |
Trademark Parties (Applicants & Owners)
| Party: |  MacDermid, Incorporated |
| Address | 245 Freight Street Waterbury, CONNECTICUT UNITED STATES 06702 |
| Legal Entity Type | Corporation |
| Legal Entity State | CONNECTICUT |
Documents
 Application | APPLICATION/XML,IMAGE/JPEG | 2022-02-03 |
 Drawing | IMAGE/JPEG | 2022-02-03 |
| Specimen | 2022-02-03 |
Attorney of Record
Good, Services, and Codes
IC 001. US 001 005 006 010 026 046. G & S: Chemical used in metallization of circuit boards and integrated chips; direct metallization chemicals for use in high-density printed circuit boards; chemicals used in the manufacture of high density interconnect circuitry; chemicals used in metallization of printed circuit board substrates. FIRST USE: 20071231. FIRST USE IN COMMERCE: 20071231
| International Codes: | 1 |
| U.S. Codes: | 001,005,006,010,026,046 |
| Type Code | Type |
|---|---|
| GS0011 | Chemical used in metallization of circuit boards and integrated chips; direct metallization chemicals for use in high-density printed circuit boards; chemicals used in the manufacture of high density interconnect circuitry; chemicals used in metallization of printed circuit board substrates |
| GS0011 | Chemical used in metallization of circuit boards and integrated chips; direct metallization chemicals for use in high-density printed circuit boards; chemicals used in the manufacture of high density interconnect circuitry; chemicals used in metallization of printed circuit board substrates |
Trademark Filing History
| Description | Date | Proceeding Number |
|---|---|---|
| NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM | 2022-02-08 | |
| NEW APPLICATION ENTERED IN TRAM | 2022-02-07 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 