Trademark/Service Mark Application, Principal Register
PTO- 1478
Approved for use through 10/31/2024. OMB 0651-0009
U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE
Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number
Trademark/Service Mark Application, Principal Register
The mark consists of standard characters, without claim to any particular font style, size, or color.
REGISTER
Principal
APPLICANT INFORMATION
*OWNER OF MARK
Etron Technology, Inc.
*MAILING ADDRESS
No. 6, Technology Road 5
*CITY
Hsinchu
*COUNTRY/REGION/JURISDICTION/U.S. TERRITORY
Taiwan
*ZIP/POSTAL CODE
(Required for U.S. and certain international addresses)
30078
*EMAIL ADDRESS
XXXX
LEGAL ENTITY INFORMATION
TYPE
corporation
STATE/COUNTRY/REGION/JURISDICTION/U.S. TERRITORY OF INCORPORATION
Taiwan
GOODS AND/OR SERVICES AND BASIS INFORMATION
INTERNATIONAL CLASS
009
*IDENTIFICATION
Computer software in the field of collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM
(Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition, and VR (Virtual Reality) , AR
(Augmented Reality) and MR(Mixed Reality); Electronic hardware and software for use in collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM
(Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Electronic security apparatus and
surveillance apparatus; Software and electronic hardware utilizing eye and gesture tracking technology; Algorithm software programs for collision avoidance, object detection, object recognition,
object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face
recognition; Semiconductor chip sets for use in enabling image signal processing; Integrated circuits and integrated circuit cores for use in image signal processing; Design libraries, namely,
downloadable electronic data files for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Chipsets; Semiconductor chip
sets; Microchips (computer hardware); Silicon chips; Semiconductor chips; Multiprocessor chips; Computer chips; integrated circuits (IC); micro circuits; micro integrated circuits; electronic
circuits; semiconductor components; chips; computer hardware; computer components; computer circuits; Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale
integrated circuits; Electric and electronic circuits; Wafers for integrated circuits; Integrated circuit cards and components; Semiconductors; Semiconductor devices; Semiconductor wafers; Chips,
chip sets, and modules for 3D sensing, 3D sensor fusion and 3D perception. For clarity purpose, 3D sensing means to collect information in 3D dimension, and 3D perception means to make certain
decision and reaction in accordance with such collected information; Plates, glass slides or chips having multi-well arrays that can be used in chemical analysis, biological analysis or patterning
for scientific, laboratory or medical research use; Semiconductor chip sets for use in enabling memory, multiway communications and processing capabilities; KGDM; known good die; known good die
memory; DRAM module; specialty DRAM; automotive DRAM; industrial DRAM; micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer memory; computer
memory devices; Integrated circuits and integrated circuit cores for use in wireless communications and wireless communication equipment and apparatus and digital signal processors (DSP); Integrated
circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Circuits for heavy current; Cards with integrated circuits; Microcircuits; Very large scale
integration (VLSI) semiconductor integrated circuits; Electric and electronic circuits; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor
design; Electronic components in the nature of semiconductors and integrated circuits; Wafers for integrated circuits; Integrated circuit cards and components; Flexible circuit boards; Dynamic random
access memory (DRAM)
FILING BASIS
SECTION 1(b)
INTERNATIONAL CLASS
042
*IDENTIFICATION
Design of integrated circuits; Design of computer hardware, integrated circuits, communications hardware and software and computer networks
for others; Development of technologies for the fabrication of circuits for wireless communication, electronic data processing, consumer electronic, automotive electronics; Design for others of
integrated circuits and integrated circuit cores for use in wireless communications and wireless communication equipment and apparatus and digital signal processors (DSP); Research, development, and
design of various electronic products and semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits,
micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components;
Structure design for semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated
circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Testing and
consulting of various electronic products and semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits,
micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components;
Quality inspection, testing and identification of semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro
circuits, micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer
components; Research in the area of semiconductor processing technology; Design and development of automated controller systems, namely, temperature, humidity and electrical controllers; Development
and implementation of software, hardware and technology solutions for the purpose of testing of electronic components and electronic systems; Development and implementation of software, hardware and
technology solutions for the purpose of productization of electronic components and electronic systems
FILING BASIS
SECTION 1(b)
ATTORNEY INFORMATION
NAME
Paulo A. de Almeida
ATTORNEY BAR MEMBERSHIP NUMBER
XXX
YEAR OF ADMISSION
XXXX
U.S. STATE/ COMMONWEALTH/ TERRITORY
XX
FIRM NAME
Patel & Almeida, P. C.
STREET
16830 Ventura Blvd., Suite 360
CITY
Encino
STATE
California
COUNTRY/REGION/JURISDICTION/U.S. TERRITORY
United States
ZIP/POSTAL CODE
91436
PHONE
818-380-1900
EMAIL ADDRESS
trademarks@paiplaw.com
OTHER APPOINTED ATTORNEY
Alex Patel, Andrew T. Rissler
CORRESPONDENCE INFORMATION
NAME
Paulo A. de Almeida
PRIMARY EMAIL ADDRESS FOR CORRESPONDENCE
trademarks@paiplaw.com
SECONDARY EMAIL ADDRESS(ES) (COURTESY COPIES)
NOT PROVIDED
FEE INFORMATION
APPLICATION FILING OPTION
TEAS Standard
NUMBER OF CLASSES
2
APPLICATION FOR REGISTRATION PER CLASS
350
*TOTAL FEES DUE
700
*TOTAL FEES PAID
700
SIGNATURE INFORMATION
SIGNATURE
/Paulo A. de Almeida/
SIGNATORY'S NAME
Paulo A. de Almeida
SIGNATORY'S POSITION
Attorney
SIGNATORY'S PHONE NUMBER
818-380-1900
DATE SIGNED
12/13/2021
SIGNATURE METHOD
Signed directly within the form
PTO- 1478
Approved for use through 10/31/2024. OMB 0651-0009
U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE
Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number
Trademark/Service Mark Application, Principal Register
Serial Number:97169865
Filing Date:12/13/2021
To the Commissioner for Trademarks:
MARK: 6dMVerse (Standard Characters, see mark)
The literal element of the mark consists of 6dMVerse. The mark consists of standard characters, without claim to any particular font style, size, or color.
The applicant, Etron Technology, Inc., a corporation of Taiwan, having an address of
No. 6, Technology Road 5
Hsinchu 30078
Taiwan
XXXX
requests registration of the trademark/service mark identified above in the United States Patent and Trademark Office on the Principal Register established by the Act of July 5, 1946 (15 U.S.C.
Section 1051 et seq.), as amended, for the following:
International Class 009: Computer software in the field of collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And
Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition, and VR (Virtual Reality) , AR (Augmented Reality) and MR(Mixed
Reality); Electronic hardware and software for use in collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and
SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Electronic security apparatus and surveillance apparatus; Software and
electronic hardware utilizing eye and gesture tracking technology; Algorithm software programs for collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM
(Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Semiconductor chip sets for use in
enabling image signal processing; Integrated circuits and integrated circuit cores for use in image signal processing; Design libraries, namely, downloadable electronic data files for use in
integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Chipsets; Semiconductor chip sets; Microchips (computer hardware); Silicon
chips; Semiconductor chips; Multiprocessor chips; Computer chips; integrated circuits (IC); micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer
hardware; computer components; computer circuits; Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Electric and electronic circuits;
Wafers for integrated circuits; Integrated circuit cards and components; Semiconductors; Semiconductor devices; Semiconductor wafers; Chips, chip sets, and modules for 3D sensing, 3D sensor fusion
and 3D perception. For clarity purpose, 3D sensing means to collect information in 3D dimension, and 3D perception means to make certain decision and reaction in accordance with such collected
information; Plates, glass slides or chips having multi-well arrays that can be used in chemical analysis, biological analysis or patterning for scientific, laboratory or medical research use;
Semiconductor chip sets for use in enabling memory, multiway communications and processing capabilities; KGDM; known good die; known good die memory; DRAM module; specialty DRAM; automotive DRAM;
industrial DRAM; micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer memory; computer memory devices; Integrated circuits and integrated circuit
cores for use in wireless communications and wireless communication equipment and apparatus and digital signal processors (DSP); Integrated circuit modules; Electronic integrated circuits; Decision
circuits; Large scale integrated circuits; Circuits for heavy current; Cards with integrated circuits; Microcircuits; Very large scale integration (VLSI) semiconductor integrated circuits; Electric
and electronic circuits; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and
integrated circuits; Wafers for integrated circuits; Integrated circuit cards and components; Flexible circuit boards; Dynamic random access memory (DRAM)
Intent to Use: The applicant has a bona fide intention, and is entitled, to use the mark in commerce on or in connection with the identified goods/services.
International Class 042: Design of integrated circuits; Design of computer hardware, integrated circuits, communications hardware and software and computer networks for others; Development of
technologies for the fabrication of circuits for wireless communication, electronic data processing, consumer electronic, automotive electronics; Design for others of integrated circuits and
integrated circuit cores for use in wireless communications and wireless communication equipment and apparatus and digital signal processors (DSP); Research, development, and design of various
electronic products and semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated
circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Structure design for
semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated circuits, electronic
circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Testing and consulting of various
electronic products and semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated
circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Quality inspection,
testing and identification of semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro
integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Research
in the area of semiconductor processing technology; Design and development of automated controller systems, namely, temperature, humidity and electrical controllers; Development and implementation of
software, hardware and technology solutions for the purpose of testing of electronic components and electronic systems; Development and implementation of software, hardware and technology solutions
for the purpose of productization of electronic components and electronic systems
Intent to Use: The applicant has a bona fide intention, and is entitled, to use the mark in commerce on or in connection with the identified goods/services.
The owner's/holder's proposed attorney information: Paulo A. de Almeida. Other appointed attorneys are Alex Patel, Andrew T. Rissler. Paulo A. de Almeida of Patel & Almeida, P. C., is a
member of the XX bar, admitted to the bar in XXXX, bar membership no. XXX, and the attorney(s) is located at
16830 Ventura Blvd., Suite 360
Encino, California 91436
United States
818-380-1900(phone)
trademarks@paiplaw.com
Paulo A. de Almeida submitted the following statement: The attorney of record is an active member in good standing of the bar of the highest court of a U.S. state, the District of Columbia, or any
U.S. Commonwealth or territory.
The applicant's current Correspondence Information:
Paulo A. de Almeida
PRIMARY EMAIL FOR CORRESPONDENCE: trademarks@paiplaw.com SECONDARY EMAIL ADDRESS(ES) (COURTESY COPIES): NOT PROVIDED
Requirement for Email and Electronic Filing: I understand that a valid email address must be maintained by the applicant owner/holder and the applicant owner's/holder's attorney, if appointed,
and that all official trademark correspondence must be submitted via the Trademark Electronic Application System (TEAS).
A fee payment in the amount of $700 has been submitted with the application, representing payment for 2 class(es).
Declaration
Declaration Signature
Signature: /Paulo A. de Almeida/ Date: 12/13/2021
Signatory's Name: Paulo A. de Almeida
Signatory's Position: Attorney
Signatory's Phone Number: 818-380-1900
Signature method: Signed directly within the form
Payment Sale Number: 97169865
Payment Accounting Date: 12/13/2021
Serial Number: 97169865
Internet Transmission Date: Mon Dec 13 18:54:58 ET 2021
TEAS Stamp: USPTO/BAS-XXX.XX.XXX.XXX-202112131854589
33965-97169865-781a71d679ba99b4cd64b62e2
19ddf28b1f3c818189a3b38a515105621889f2d-
CC-54570894-20211213185242857686