Application

PTO- 1478

Approved for use through 10/31/2024. OMB 0651-0009

U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number

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PTO- 1478

Approved for use through 10/31/2024. OMB 0651-0009

U.S. Patent and Trademark Office; U.S. DEPARTMENT OF COMMERCE Under the Paperwork Reduction Act of 1995, no persons are required to respond to a collection of information unless it contains a valid OMB control number

Trademark/Service Mark Application, Principal Register

Serial Number: 97068631

Filing Date: 10/11/2021

To the Commissioner for Trademarks:

MARK: WELCO (Standard Characters, see mark)
The literal element of the mark consists of WELCO. The mark consists of standard characters, without claim to any particular font style, size, or color.
The applicant, Heraeus Deutschland GmbH & Co. KG, a gmbh & co. kg legally organized under the laws of Germany, having an address of
      Heraeusstr. 12-14
      Hanau 63450
      Germany
      XXXX

requests registration of the trademark/service mark identified above in the United States Patent and Trademark Office on the Principal Register established by the Act of July 5, 1946 (15 U.S.C. Section 1051 et seq.), as amended, for the following:

International Class 001:  Agents for use in soldering in microelectronic industry; soldering pastes

Priority based on foreign filing: The applicant has a bona fide intention, and is entitled, to use the mark in commerce on or in connection with the identified goods/services and asserts a claim of priority based on European Union Trademark - EUTM application number 018457087, filed 04/20/2021.
INTENT TO PERFECT 44(d) : At this time, the applicant intends to rely on Section 44(e) as a basis for registration. If ultimately the applicant does not rely on Section 44(e) as a basis for registration, a valid claim of priority may be retained.


International Class 006:  Lead-free solders for the microelectronic industry, in particular microelectronic chip industry, in particular tin comprising solders; pastes and inks of soldering preparations for wave soldering, THT-soldering, through-hole technology-soldering, and SMD-soldering, surface mounted technology soldering, wherein the pastes and inks comprising solder metal and their alloys and flux for printing of electronic components, in particular in chip-industry, semiconductor-industry, consumer electronic-industry and automotive-industry; pastes and inks of soldering preparations comprising solder metal and their alloys and flux for depositing, in particular printing of electronic components in semiconductor-industry to be soldered semi-automatically or fully automatically after placement; pastes and inks of soldering preparations comprising solder metal and their alloys and flux for depositing, in particular printing, of electronic components in semiconductor-industry to be soldered semiautomatically or fully automatically after placement, wherein the pastes and inks comprises as solder metal and their alloy as soft solder in form of a powder having a particle size of less than 100 micrometer of tin, copper, zinc and/or silver or an alloy of at least two of the metals; pastes and inks of soldering preparations comprising solder metal and their alloy and flux for printing of electronic components in industry, such as microelectronic contacts and/or microelectronic conducting paths, in particular in stencil printing, screen printing, mask printing processes, in particular each followed by a heating up to less than 300 Degrees-Celsius, in particular the solder metal and their alloys comprising tin, copper, zinc and/or silver or an alloy of at least two of the metals; pastes and inks of soldering preparations comprising solder metal and their alloy and flux for printing of electronic components in industry, in particular in microelectronic industry, preferred in microelectronic chip industry, consumer electronic industry, semiconductor-industry, and/or automotive industry, in particular the solder metal and their alloys comprising tin, copper, zinc and/or silver or an alloy of at least two of the metals, preferred the solder is free from iron and free from lead; common metals, precious metals, and their alloys in powder form, free form iron and free form lead, wherein the particles of the powder having a particle size of less than 50 micrometer for use in depositing pastes, printing pastes and printing inks for the production of electronic conducting paths and/or electronic conducing contacts in microelectronic industry, in particular for use in chip-production with pitches or line space below 300 micrometer; All goods preferred for use in chip-production with pitches or line space from 100 nanometer up to 200 micrometer; All goods preferred for use in processes for the production in microchip industry for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), in particular comprising as metals tin, copper, zinc and/or silver or an alloy of at least of two of the metals; pastes and inks comprising common metals, precious metals and alloys in powder form and flux, wherein the metals and alloys are free from iron and free from lead, wherein the particles of the powder having a particle size of less than 50 micrometer, in particular pastes and inks according to Industry Specifications, such as IPC, preferred IPC J-STD-005A:2012-02-14 classes T5 to T8 and/or IPC J-STD-001; pastes and inks of soldering preparations comprising spherical particles of soft solder in a dispersing media comprising flux, in particular organic flux of mixture of solvents and resins and optional activated chemicals to provide pastes and inks viscosity for depositing, in particular by printing, wherein the spherical particles have an aspect ratio of the diameters of nearly 1; pastes and inks of soldering preparations comprising spherical particles of soft solder and flux, wherein the particles are obtained in a dispersion process in which liquid metal or liquid alloy is dispersed in a dispersing media, wherein the flux comprises organic flux to provide pastes and inks a viscosity for depositing; Preferred all goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC); soft solder for microelectronic application in the form of a printable paste for use in microelectronic application, wherein the paste comprises powder having a particle size of less than 50 micrometers of tin, copper, zinc and silver; in particular all of the above mentioned goods comprising tin; in particular all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and/or iron-containing components, in particular in the field of gas and water pipes.

Priority based on foreign filing: The applicant has a bona fide intention, and is entitled, to use the mark in commerce on or in connection with the identified goods/services and asserts a claim of priority based on European Union Trademark - EUTM application number 018457087, filed 04/20/2021.
INTENT TO PERFECT 44(d) : At this time, the applicant intends to rely on Section 44(e) as a basis for registration. If ultimately the applicant does not rely on Section 44(e) as a basis for registration, a valid claim of priority may be retained.




The owner's/holder's proposed attorney information: Nathaniel Kramer. Nathaniel Kramer of Kirschstein Israel Schiffmiller & Pieroni, is a member of the XX bar, admitted to the bar in XXXX, bar membership no. XXX, is located at
      Fifth Floor
      425 Fifth Avenue
      New York, New York 10016
      United States
      212-697-3750 x135(phone)
      ndkramer@mindspring.com
The docket/reference number is Bendele 806.
Nathaniel Kramer submitted the following statement: The attorney of record is an active member in good standing of the bar of the highest court of a U.S. state, the District of Columbia, or any U.S. Commonwealth or territory.

The applicant's current Correspondence Information:

Nathaniel Kramer

PRIMARY EMAIL FOR CORRESPONDENCE: ndkramer@mindspring.com       SECONDARY EMAIL ADDRESS(ES) (COURTESY COPIES): NOT PROVIDED Requirement for Email and Electronic Filing: I understand that a valid email address must be maintained by the applicant owner/holder and the applicant owner's/holder's attorney, if appointed, and that all official trademark correspondence must be submitted via the Trademark Electronic Application System (TEAS).

A fee payment in the amount of $700 has been submitted with the application, representing payment for 2 class(es).

Declaration

	Basis: If the applicant is filing the application based on use in commerce under 15 U.S.C. § 1051(a): The signatory believes that the applicant is the owner of the trademark/service mark sought to be registered; The mark is in use in commerce and was in use in commerce as of the filing date of the application on or in connection with the goods/services in the application; The specimen(s) shows the mark as used on or in connection with the goods/services in the application and was used on or in connection with the goods/services in the application as of the application filing date; and To the best of the signatory's knowledge and belief, the facts recited in the application are accurate. And/Or If the applicant is filing the application based on an intent to use the mark in commerce under 15 U.S.C. § 1051(b), § 1126(d), and/or § 1126(e): The signatory believes that the applicant is entitled to use the mark in commerce; The applicant has a bona fide intention to use the mark in commerce and had a bona fide intention to use the mark in commerce as of the application filing date on or in connection with the goods/services in the application; and To the best of the signatory's knowledge and belief, the facts recited in the application are accurate.
	To the best of the signatory's knowledge and belief, no other persons, except, if applicable, concurrent users, have the right to use the mark in commerce, either in the identical form or in such near resemblance as to be likely, when used on or in connection with the goods/services of such other persons, to cause confusion or mistake, or to deceive.
	To the best of the signatory's knowledge, information, and belief, formed after an inquiry reasonable under the circumstances, the allegations and other factual contentions made above have evidentiary support.
	The signatory being warned that willful false statements and the like are punishable by fine or imprisonment, or both, under 18 U.S.C. § 1001, and that such willful false statements and the like may jeopardize the validity of the application or submission or any registration resulting therefrom, declares that all statements made of his/her own knowledge are true and all statements made on information and belief are believed to be true.

Declaration Signature

Signature: /Nathaniel Kramer/   Date: 10/11/2021
Signatory's Name: Nathaniel Kramer
Signatory's Position: Attorney of record, New York Bar member.
Signatory's Phone Number: 212-697-3750 x135
Signature method: Signed directly within the form
Payment Sale Number: 97068631
Payment Accounting Date: 10/12/2021

Serial Number: 97068631
Internet Transmission Date: Mon Oct 11 15:41:49 ET 2021
TEAS Stamp: USPTO/BAS-XX.XXX.XXX.XX-2021101115414918
6927-97068631-781e6c273ef4c10e7c47fabb74
7ae9284d4c6385dfbd879854889228a09d339e6b
-CC-41473186-20211011151450231274