R.F.C.P.
Towa Corporation
Application Filed: 2021-11-01
Trademark Application Details
NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
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| Serial Number | 79330300 |
| Mark Drawing Code | 4000: Illustration: Drawing with word(s)/letter(s)/number(s) in Block form |
Timeline
| 2021-11-01 | Application Filed |
| 2022-01-06 | Location: INITIAL REVIEW/SERIALIZATION BRANCH(MAILROOM) |
| 2022-01-06 | Status: Live/Pending |
| 2022-01-14 | Transaction Date |
Trademark Applicants & Owners
| Owner: |  TOWA CORPORATION |
| Address | 5, Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-shi Kyoto 601-8105 JP |
| Legal Entity Type | Corporation |
| Legal Entity State | JP |
Documents
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Attorney of Record
Good, Services, and Codes
| International Codes: | 7 |
| U.S. Codes: | 013,019,021,023,024,031,034,035 |
| Type Code | Type |
|---|---|
| GS0071 | Molds for sealing resins for manufacturing semiconductors; molds for manufacturing semiconductors; resin sealing machines for manufacturing semiconductors and parts and fittings thereof; parts of semiconductor manufacturing machines, namely, molds being parts of machines for use in the manufacture of semiconductors; semiconductor manufacturing machines and parts and fittings thereof; semiconductor processing machines and apparatus and parts and fittings thereof; molds for sealing resins of integrated circuits; molds for sealing resins of electronic circuits; molds for sealing resins of circuit boards; molds for sealing resins of electronic parts; resin sealing machines for integrated circuits and parts and fittings thereof; resin sealing machines for electronic circuits and parts and fittings thereof; resin sealing machines for circuit boards and parts and fittings thereof; resin sealing machines for electronic parts and parts and fittings thereof; integrated circuits manufacturing machines and parts and fittings thereof; electronic circuits manufacturing machines and parts and fittings thereof; molds for processing resins; molds for processing plastics; plastic processing machines and apparatus and parts and fittings thereof |
| GS0071 | Machine parts, namely, molds for sealing resins for use in the manufacture of semiconductors; Machine parts, namely, molds for use in manufacturing semiconductors; resin sealing machines for manufacturing semiconductors and parts and fittings thereof; parts of semiconductor manufacturing machines, namely, molds being parts of machines for use in the manufacture of semiconductors; semiconductor manufacturing machines and parts and fittings thereof; semiconductor processing machines and apparatus and parts and fittings thereof; Machine parts, namely, molds for sealing resins for use in the manufacture of integrated circuits; Machine parts, namely, molds for sealing resins for use in the manufacture of electronic circuits; Machine parts, namely, molds for sealing resins for use in the manufacture of circuit boards; Machine parts, namely, molds for sealing resins for use in the manufacture of electronic parts; resin sealing machines for integrated circuits and parts and fittings thereof; resin sealing machines for electronic circuits and parts and fittings thereof; resin sealing machines for circuit boards and parts and fittings thereof; resin sealing machines for electronic parts and parts and fittings thereof; integrated circuits manufacturing machines and parts and fittings thereof; electronic circuits manufacturing machines and parts and fittings thereof; Resin processing machine parts, namely, molds for processing resins; Plastic processing machine parts, namely, molds for processing plastics; plastic processing machines and apparatus and parts and fittings thereof |
Trademark Filing History
| Description | Date | Event Coding |
|---|---|---|
| SN ASSIGNED FOR SECT 66A APPL FROM IB | 2022-01-06 | 1 REPR M: |
| LIMITATION FROM ORIGINAL APPLICATION ENTERED | 2022-01-13 | 2 LIMI I:Incoming Correspondence |
| NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM | 2022-01-14 | 3 NWOS I:Incoming Correspondence |
| APPLICATION FILING RECEIPT MAILED | 2022-01-18 | 4 MAFR O:Outgoing Correspondence |
| ASSIGNED TO EXAMINER | 2022-08-10 | 5 DOCK D:Assigned to Examiner |
| NON-FINAL ACTION WRITTEN | 2022-08-17 | 6 CNRT R:Renewal |
| NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | 2022-08-18 | 7 RFCR E:E-Mail |
| REFUSAL PROCESSED BY MPU | 2022-09-03 | 8 RFRR P: |
| NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | 2022-09-03 | 9 RFCS P: |
| REFUSAL PROCESSED BY IB | 2022-09-27 | 10 RFNT P: |
| TEAS RESPONSE TO OFFICE ACTION RECEIVED | 2023-01-20 | 11 TROA I:Incoming Correspondence |
| CORRESPONDENCE RECEIVED IN LAW OFFICE | 2023-01-20 | 12 CRFA I:Incoming Correspondence |
| TEAS/EMAIL CORRESPONDENCE ENTERED | 2023-01-20 | 13 TEME I:Incoming Correspondence |
| APPROVED FOR PUB - PRINCIPAL REGISTER | 2023-01-23 | 14 CNSA O:Outgoing Correspondence |
| NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | 2023-02-08 | 15 NONP E:E-Mail |
| NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB | 2023-02-08 | 16 OP2R P: |
| NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB | 2023-02-08 | 17 OPNS P: |
| NOTIFICATION PROCESSED BY IB | 2023-02-27 | 18 GPNX P: |
| PUBLISHED FOR OPPOSITION | 2023-02-28 | 19 PUBO A:Allowance for Publication |
| OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | 2023-02-28 | 20 NPUB E:E-Mail |
| REGISTERED-PRINCIPAL REGISTER | 2023-05-16 | 21 R.PR A:Allowance for Publication |
| NOTICE OF REGISTRATION CONFIRMATION EMAILED | 2023-05-16 | 22 NRCC E:E-Mail |
| FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | 2023-08-16 | 23 FICR P: |
| FINAL DISPOSITION PROCESSED | 2023-08-21 | 24 FIMP P: |
| FINAL DISPOSITION NOTICE SENT TO IB | 2023-08-21 | 25 FICS P: |
| FINAL DECISION TRANSACTION PROCESSED BY IB | 2023-09-12 | 26 FINO P: |
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