CELLFIL
Taiyo Holdings Co., Ltd.
Trademark Registered: 2022-05-31
Trademark Application Details
NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
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| Serial Number | 79313789 |
| Registration Number | 6741699 |
| Mark Drawing Code | 4000: Illustration: Drawing with word(s)/letter(s)/number(s) in Block form |
Timeline
| 2021-02-22 | Application Filed |
| 2021-06-24 | Location: INITIAL REVIEW/SERIALIZATION BRANCH(MAILROOM) |
| 2021-06-24 | Status: Live/Pending |
| 2021-06-30 | Transaction Date |
| 2022-05-31 | Trademark Registered |
Trademark Applicants & Owners
| Owner: |  TAIYO HOLDINGS CO., LTD. |
| Address | 388 Ohkura, Ranzan-machi, Hiki-gun Saitama 355-0222 JP |
| Legal Entity Type | Corporation |
| Legal Entity State | JP |
Documents
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Attorney of Record
Good, Services, and Codes
| International Codes: | 1 |
| U.S. Codes: | 001,005,006,010,026,046 |
| International Codes: | 2 |
| U.S. Codes: | 006,011,016 |
| International Codes: | 17 |
| U.S. Codes: | 001,005,012,013,035,050 |
| Type Code | Type |
|---|---|
| GS0011 | Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the form of film for sealing electronic components; unexposed dry films, namely, mold dry films for electronic components; unexposed dry films, namely, insulation mold dry films for electronic components; unexposed dry films, namely, thermal curing type mold films for electronic components; chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; sealants for use in the process of producing electronic components; resin sealants for use in the process of producing electronic components; heat resisting materials; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes |
| GS0171 | Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for sealing electronic components; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package application boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics |
Trademark Filing History
| Description | Date | Event Coding |
|---|---|---|
| SN ASSIGNED FOR SECT 66A APPL FROM IB | 2021-06-24 | 1 REPR M: |
| LIMITATION FROM ORIGINAL APPLICATION ENTERED | 2021-06-28 | 2 LIMI I:Incoming Correspondence |
| NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM | 2021-06-30 | 3 NWOS I:Incoming Correspondence |
| APPLICATION FILING RECEIPT MAILED | 2021-07-06 | 4 MAFR O:Outgoing Correspondence |
| CORRECTION TRANSACTION RECEIVED FROM IB | 2021-07-31 | 5 CRCV M: |
| CORRECTION FROM IB ENTERED - NO REVIEW REQUIRED | 2021-08-05 | 6 CORR I:Incoming Correspondence |
| ASSIGNED TO EXAMINER | 2021-09-16 | 7 DOCK D:Assigned to Examiner |
| NON-FINAL ACTION WRITTEN | 2021-09-24 | 8 CNRT R:Renewal |
| NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW | 2021-09-25 | 9 RFCR E:E-Mail |
| REFUSAL PROCESSED BY MPU | 2021-10-12 | 10 RFRR P: |
| NON-FINAL ACTION MAILED - REFUSAL SENT TO IB | 2021-10-12 | 11 RFCS P: |
| REFUSAL PROCESSED BY IB | 2021-11-05 | 12 RFNT P: |
| TEAS RESPONSE TO OFFICE ACTION RECEIVED | 2022-02-09 | 13 TROA I:Incoming Correspondence |
| CORRESPONDENCE RECEIVED IN LAW OFFICE | 2022-02-09 | 14 CRFA I:Incoming Correspondence |
| TEAS/EMAIL CORRESPONDENCE ENTERED | 2022-02-09 | 15 TEME I:Incoming Correspondence |
| APPROVED FOR PUB - PRINCIPAL REGISTER | 2022-02-09 | 16 CNSA O:Outgoing Correspondence |
| TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | 2022-02-14 | 17 REAP I:Incoming Correspondence |
| ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | 2022-02-14 | 18 ARAA I:Incoming Correspondence |
| TEAS CHANGE OF CORRESPONDENCE RECEIVED | 2022-02-14 | 19 TCCA I:Incoming Correspondence |
| NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED | 2022-02-23 | 20 NONP E:E-Mail |
| NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB | 2022-02-23 | 21 OP2R P: |
| NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB | 2022-02-23 | 22 OPNS P: |
| PUBLISHED FOR OPPOSITION | 2022-03-15 | 23 PUBO A:Allowance for Publication |
| OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED | 2022-03-15 | 24 NPUB E:E-Mail |
| NOTIFICATION PROCESSED BY IB | 2022-03-21 | 25 GPNX P: |
| REGISTERED-PRINCIPAL REGISTER | 2022-05-31 | 26 R.PR A:Allowance for Publication |
| NOTICE OF REGISTRATION CONFIRMATION EMAILED | 2022-05-31 | 27 NRCC E:E-Mail |
| CHANGE OF NAME/ADDRESS REC'D FROM IB | 2022-07-09 | 28 ADCH M: |
| FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB | 2022-08-31 | 29 FICR P: |
| FINAL DISPOSITION PROCESSED | 2022-09-15 | 30 FIMP P: |
| FINAL DISPOSITION NOTICE SENT TO IB | 2022-09-15 | 31 FICS P: |
| FINAL DECISION TRANSACTION PROCESSED BY IB | 2022-10-10 | 32 FINO P: |
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