BULC
NGK Spark Plug Co., Ltd.
Application Filed: 2004-09-22
Trademark Application Details
CANCELLED - SECTION 8
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| Serial Number | 78488026 |
| Registration Number | 3185525 |
| Mark Drawing Code | 4000: Illustration: Drawing with word(s)/letter(s)/number(s) in Block form |
| Cancellation Code | 2 |
| Domestic Representative | Lawrence E. Abelman |
| Attorney Name | Lawrence E. Abelman |
| Attorney Docket Number | 870254 |
| Law Office Assigned | L40 |
| Employee Name | FOLEY, TAMARA Y |
Timeline
| 2001-11-01 | Date of First Use |
| 2004-09-22 | Application Filed |
| 2006-10-03 | Published for Opposition |
| 2006-12-19 | Location: PUBLICATION AND ISSUE SECTION |
| 2006-12-19 | Trademark Registered |
| 2013-07-26 | Cancelled |
| 2013-07-26 | Status: Dead/Cancelled |
| 2018-07-08 | Transaction Date |
Trademark Applicants & Owners
| Owner: |  NGK Spark Plug Co., Ltd. |
| Address | 14-18, Takatsuji-cho, Mizuho-ku Nagoya City JP |
| Legal Entity Type | Corporation |
| Legal Entity State | JP |
Documents
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Attorney of Record
Good, Services, and Codes
| International Codes: | 9 |
| U.S. Codes: | 021,023,026,036,038 |
| Type Code | Type |
|---|---|
| GS0091 | Substrates for semi-conductors, namely, supporting board on which integrated circuits, chip condensers and chip capacitors are attached or in which integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, namely, supporting boards that are attached in thermal printer heads; polyimide thin film multilayer substrates for semi-conductors, namely, supporting material on which integrated circuits, chip condensers and chip capacitors are attached-- integrated circuits and circuits boards for semi-conductors; chip packages, namely, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator SAW (Surface Acoustic Wave) filter package, namely, protective housings for crystal resonator; SAW(Surface Acoustic Wave) and filter; leadless chip carriers; interposers for semi-conductors, namely, connecters for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages, namely, supporting boards on which pins are gridded arrayed; ball grid array chip packages, namely, supporting boards on which balls are gridded arrayed; flat packages, namely, housings for integrated circuits; multi-chip module substrates, namely, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resisters and chip inductors are installed; packages for high frequency band, namely, protective housings working in high frequency band area; aluminum nitride products, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; cerdips, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards |
Trademark Filing History
| Description | Date | Event Coding |
|---|---|---|
| NEW APPLICATION ENTERED IN TRAM | 2004-09-29 | 1 NWAP I:Incoming Correspondence |
| ASSIGNED TO EXAMINER | 2005-04-22 | 2 DOCK D:Assigned to Examiner |
| NON-FINAL ACTION WRITTEN | 2005-04-26 | 3 CNRT R:Renewal |
| NON-FINAL ACTION MAILED | 2005-04-26 | 4 CNRT F:First Action |
| PAPER RECEIVED | 2005-09-19 | 5 MAIL I:Incoming Correspondence |
| CORRESPONDENCE RECEIVED IN LAW OFFICE | 2005-09-16 | 6 CRFA I:Incoming Correspondence |
| AMENDMENT FROM APPLICANT ENTERED | 2005-09-28 | 7 ACEC I:Incoming Correspondence |
| FINAL REFUSAL WRITTEN | 2006-02-05 | 8 CNFR R:Renewal |
| FINAL REFUSAL MAILED | 2006-02-06 | 9 CNFR O:Outgoing Correspondence |
| PAPER RECEIVED | 2006-02-07 | 10 MAIL I:Incoming Correspondence |
| APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED | 2006-03-03 | 11 CHAN I:Incoming Correspondence |
| TEAS RESPONSE TO OFFICE ACTION RECEIVED | 2006-05-17 | 12 TROA I:Incoming Correspondence |
| CORRESPONDENCE RECEIVED IN LAW OFFICE | 2006-05-17 | 13 CRFA I:Incoming Correspondence |
| TEAS/EMAIL CORRESPONDENCE ENTERED | 2006-05-24 | 14 TEME I:Incoming Correspondence |
| ASSIGNED TO EXAMINER | 2006-08-02 | 15 DOCK D:Assigned to Examiner |
| APPROVED FOR PUB - PRINCIPAL REGISTER | 2006-08-04 | 16 CNSA O:Outgoing Correspondence |
| ASSIGNED TO LIE | 2006-08-11 | 17 ALIE A:Allowance for Publication |
| LAW OFFICE PUBLICATION REVIEW COMPLETED | 2006-08-15 | 18 PREV O:Outgoing Correspondence |
| NOTICE OF PUBLICATION | 2006-09-13 | 19 NPUB O:Outgoing Correspondence |
| PUBLISHED FOR OPPOSITION | 2006-10-03 | 20 PUBO A:Allowance for Publication |
| REGISTERED-PRINCIPAL REGISTER | 2006-12-19 | 21 R.PR A:Allowance for Publication |
| CANCELLED SEC. 8 (6-YR) | 2013-07-26 | 22 C8.. O:Outgoing Correspondence |
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