| FILING RECEIPT FOR TRADEMARK APPLICATION |
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| Mar 26, 2004 |
| This acknowledges receipt on the FILING DATE of the application for registration for the mark identified below. The FILING DATE is contingent upon all minimum filing date requirements being met. Your application will be considered in the order in which it was received. Action on the merits should be expected from the United States Patent and Trademark Office (USPTO) approximately six months from the FILING DATE. When inquiring about this application, include the SERIAL NUMBER, FILING DATE, OWNER NAME and MARK. |
| BRIAN J. MCNAMARA FOLEY & LARDNER WASHINGTON HARBOUR 3000 K STREET, N.W., SUITE 500 WASHINGTON, D.C. 20007-5143 |
ATTORNEY REFERENCE NUMBER 073691/0697 |
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PLEASE REVIEW THE ACCURACY OF THE FILING RECEIPT DATA.
A request for correction to the filing receipt should be submitted within 30 days. Such request may be submitted by mail to: COMMISSIONER FOR TRADEMARKS , 2900 CRYSTAL DRIVE
, ARLINGTON , VIRGINIA 22202-3514 ; by fax to 703-308-9096; or by e-mail to tmfiling.receipt@uspto.gov. The USPTO will review the request and make corrections when appropriate. |
| SERIAL NUMBER: | 76/579730 |
| FILING DATE: | Mar 8, 2004 |
| REGISTER: | Principal |
| LAW OFFICE: | 113 |
| MARK: | TCHP |
| MARK TYPE(S): | Trademark |
| DRAWING TYPE: | Stylized words, letters, or numbers |
| FILING BASIS: | Sect. 1(a) (Use in Commerce) |
| ATTORNEY: | Brian J. McNamara |
| DOMESTIC REPRESENTATIVE: | FOLEY & LARDNER |
| OWNER: | Taiyo Ink Seizo Kabushiki Kaisha (NOT PROVIDED, Unknown), DBA Taiyo Ink Mfg. Co., Ltd. 2-7-1, Hazawa, Nerima-ku Tokyo , JAPAN |
| FOR: | Chemicals; chemical agent; fluxing materials; coating materials for use with printed circuit board; filling materials for hole plugging for use with printed
circuit board; thermally curable type adhesives for intermediate materials for use with build-up board; adhesives (not used for office or home work); photo materials; photo resist INT. CLASS: 001 FIRST USE: Jun 2003 |
| FOR: | Printing inks; filling inks for hole plugging for use with printed circuit board; thermally curable hole plugging inks for use with build-up board INT. CLASS: 002 FIRST USE: Jun 2003 |
| FOR: | electrical insulating materials; insulating resin materials; insulating resin materials for liquid intermediate dielectric materials for use on build-up board;
thermally curable type insulating resin materials for intermediate dielectric materials for use on build-up board INT. CLASS: 017 FIRST USE: Jun 2003 |