KS KULICKE & SOFFA
Kulicke And Soffa Industries, Inc.
Mark For: KS KULICKE & SOFFA® trademark registration is intended to cover the categories of
>Color is not claimed as a feature of the mark.
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| Serial Number | 76328761 |
| Registration Number | 2788018 |
| Mark Literal Elements | KS KULICKE & SOFFA |
| Mark Drawing Type | 5 - AN ILLUSTRATION DRAWING WITH WORD(S) /LETTER(S)/ NUMBER(S) INSTYLIZED FORM |
| Mark Type | TRADEMARK. SERVICE MARK |
| Standard Character Claim | No |
| Register | PRINCIPAL |
| Affidavit Text | SECT 15. SECT 8 (6-YR). SECTION 8(10-YR) 20140617. |
| Affidavit Text | 1ST RENEWAL 20140617 |
| Current Location | GENERIC WEB UPDATE 2014-06-17 |
| Basis | 1(a) |
| Class Status | ACTIVE |
| Primary US Classes |
|
| Primary International Class |
|
| Filed Use | Yes |
| Current Use | Yes |
| Intent To Use | No |
| Filed ITU | No |
| 44D Filed | No |
| 44E Current | No |
| 66A Current | No |
| Current Basis | No |
| No Basis | No |
| Attorney Name | Christopher M. Spletzer, Sr. |
| Attorney Docket Number | TM-003US |
| Law Office Assigned | M40 |
| Employee Name | KAZAZIAN, MICHAEL H |
Timeline
| 1ST RENEWAL 20140617 | Renewal Date |
| 2000-05-00 | Date of First Use |
| 2000-05-01 | Date of First Use |
| 2000-05-01 | Date of Use In Commerce |
| 2001-10-24 | Application Filed |
| 2003-09-09 | Published |
| 2003-09-09 | Published for Opposition |
| 2003-12-02 | Trademark Registered |
| 2013-12-02 | Renewal Date |
| 2014-06-17 | Location: GENERIC WEB UPDATE |
| 2014-06-17 | Status: Live/Registered |
| 2014-06-17 | Status: The registration has been renewed. |
| 2018-07-08 | Transaction Date |
Trademark Parties (Applicants & Owners)
| Party: |  KULICKE AND SOFFA INDUSTRIES, INC. |
| Address | 1005 VIRGINIA DRIVE FORT WASHINGTON, PENNSYLVANIA UNITED STATES 19034 |
| Legal Entity Type | Corporation |
| Legal Entity State | PENNSYLVANIA |
Documents
Application
Registration CertificateAttorney of Record
Good, Services, and Codes
IC 007. US 013 019 021 023 031 034 035. G & S: Dicing blades, namely, power-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipment, namely, semiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; [ solder ball placement equipment, namely, semiconductor assembly equipment used to place solder balls onto substrate material; ] wafer bumping equipment, namely, semiconductor assembly equipment for bonding stud bumps onto a silicon wafer; [ and wafer preparation equipment, namely, semiconductor assembly equipment for placing the wafer onto a plastic membrane and metal frame ]. FIRST USE: 20000500. FIRST USE IN COMMERCE: 20000500
IC 008. US 023 028 044. G & S: Hand-operated wire bonding equipment, namely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductors, namely die collets, capillaries and wedge bonders. FIRST USE: 20000500. FIRST USE IN COMMERCE: 20000500
IC 009. US 021 023 026 036 038. G & S: Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materials, namely, substrates with copper inlay, [ polymer materials, namely, wire encapsulants applied over wire bonds to lock individual wires in place prior to molding, ] and bonding wires; bonder software, namely, software used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; [ dicing equipment, namely, electrical dicing equipment for sawing integrated circuit wafers and other hard materials into usable single components; ] factory automation software, namely, software designed for automated semiconductor material flow and gathering and collecting semiconductor assembly equipment data; [ wafer test products, namely, semiconductor probe cards that test the electrical functionality of an integrated circuit chip; package test products, namely, electrical sockets and contactors for testing the electrical functionality of a completed integrated circuit package; and electrical circuit substrates ]. FIRST USE: 20000500. FIRST USE IN COMMERCE: 20000500
IC 035. US 100 101 102. G & S: Providing on-line electronic commerce services, namely, on-line catalog for selection, [ ordering and payment ] of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing [ equipment and ] blades, factory automation products and services, [ electrical circuit substrates, ] manual wire bonding equipment, [ solder ball placement equipment, ] wafer bumping equipment, wafer bumping services, [ wafer preparation equipment, wafer test products and package test products, ] and on-line customer support services [ relating thereto ], namely, on-line supply, on-line logistics and support, on-line consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plants to enhance overall yields and reduce cycle times. FIRST USE: 20010700. FIRST USE IN COMMERCE: 20010700
IC 037. US 100 103 106. G & S: Maintenance and refurbishment of equipment used in back-end assembly of semiconductors, namely, integrated circuit ball bonders, wedge bonders, manual wire bonders, [ automated dicing equipment, ] ribbon bonders, stud bumpers, [ wafer preparation equipment, testing equipment and ball attachment equipment; ] on-line consulting and advisory services for said equipment maintenance and refurbishment. FIRST USE: 20000500. FIRST USE IN COMMERCE: 20000500
IC 040. US 100 103 106. G & S: Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors; [ assembly services for others, namely, prototype building of mechanical components and printed circuit boards; and wafer bumping services for others, namely, semiconductor assembly services for placement of solder balls onto individual integrated electrical circuits ]. FIRST USE: 20010300. FIRST USE IN COMMERCE: 20010300
IC 041. US 100 101 107. G & S: Customer training in the use of equipment for back-end assembly of semiconductors; [ on-line consulting and advisory services for said training ]. FIRST USE: 20000500. FIRST USE IN COMMERCE: 20000500
IC 042. US 100 101. G & S: Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging product design application support for the development, testing and assembly of new electrical circuits, all in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined information, which includes search engines and on-line web links to other web sites; design and fabrication services for others, namely, design and engineering of electrical printed circuit boards used in the semiconductor industry and the design and manufacturing of digital, analog and mix signal circuit boards; ] technical support services rendered in person, via telephone and via global computer network relating to the use of equipment used for the back-end assembly of semiconductors and installation of spare parts therefor. FIRST USE: 20010300. FIRST USE IN COMMERCE: 20010300
| International Codes: | 7 |
| U.S. Codes: | 013,019,021,023,031,034,035 |
| International Codes: | 8 |
| U.S. Codes: | 023,028,044 |
| International Codes: | 9 |
| U.S. Codes: | 021,023,026,036,038 |
| International Codes: | 35 |
| U.S. Codes: | 100,101,102 |
| International Codes: | 37 |
| U.S. Codes: | 100,103,106 |
| International Codes: | 40 |
| U.S. Codes: | 100,103,106 |
| International Codes: | 41 |
| U.S. Codes: | 100,101,107 |
| International Codes: | 42 |
| U.S. Codes: | 100,101 |
| Type Code | Type |
|---|---|
| CC0000 | Color is not claimed as a feature of the mark. |
Trademark Filing History
| Description | Date | Proceeding Number |
|---|---|---|
| TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | 2018-01-29 | |
| ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | 2018-01-29 | |
| REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) | 2014-06-17 | 75184 |
| REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED | 2014-06-17 | 75184 |
| NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED | 2014-06-17 | |
| CASE ASSIGNED TO POST REGISTRATION PARALEGAL | 2014-06-17 | 75184 |
| TEAS SECTION 8 & 9 RECEIVED | 2014-05-30 | |
| REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. | 2010-01-04 | 67603 |
| AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP | 2009-12-16 | |
| CASE ASSIGNED TO POST REGISTRATION PARALEGAL | 2009-12-12 | 67603 |
| AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP | 2009-12-09 | |
| TEAS SECTION 8 & 15 RECEIVED | 2009-12-02 | |
| EXPARTE APPEAL TERMINATED | 2003-12-03 | 328761 |
| REGISTERED-PRINCIPAL REGISTER | 2003-12-02 | |
| PUBLISHED FOR OPPOSITION | 2003-09-09 | |
| NOTICE OF PUBLICATION | 2003-08-20 | |
| APPROVED FOR PUB - PRINCIPAL REGISTER | 2003-06-30 | |
| CASE FILE IN TICRS | 2003-05-20 | |
| JURISDICTION RESTORED TO EXAMINING ATTORNEY | 2003-05-12 | |
| EX PARTE APPEAL-INSTITUTED | 2003-04-29 | 328761 |
| EXPARTE APPEAL RECEIVED AT TTAB | 2003-04-25 | |
| PAPER RECEIVED | 2003-04-11 | |
| FINAL REFUSAL MAILED | 2002-10-10 | |
| ASSIGNED TO EXAMINER | 2002-09-27 | 76072 |
| PAPER RECEIVED | 2002-08-26 | |
| CORRESPONDENCE RECEIVED IN LAW OFFICE | 2002-08-26 | |
| NON-FINAL ACTION MAILED | 2002-02-25 | |
| ASSIGNED TO EXAMINER | 2002-02-22 | 78301 |
| PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED | 2001-12-14 | |
| CORRESPONDENCE RECEIVED IN LAW OFFICE | 2001-12-14 |
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