EBATRONFILL
Ebara Corporation
Mark For: EBATRONFILL® trademark registration is intended to cover the category of
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Acronym Finder
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| Serial Number | 76080448 |
| Registration Number | 2645119 |
| Mark Literal Elements | EBATRONFILL |
| Mark Drawing Type | 5 - AN ILLUSTRATION DRAWING WITH WORD(S) /LETTER(S)/ NUMBER(S) INSTYLIZED FORM |
| Mark Type | TRADEMARK |
| Standard Character Claim | No |
| Register | PRINCIPAL |
| Current Location | SCANNING ON DEMAND 2008-01-09 |
| Basis | 44(e) |
| Class Status | SECTION 8 - CANCEL |
| Primary US Classes |
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| Primary International Class |
|
| Filed Use | No |
| Current Use | No |
| Intent To Use | No |
| Filed ITU | Yes |
| 44D Filed | Yes |
| 44E Current | Yes |
| 66A Current | No |
| Current Basis | No |
| No Basis | No |
| Cancellation Code | 2 |
| Domestic Representative | Abelman, Frayne & Schwab |
| Attorney Name | Lawrence E. Abelman |
| Attorney Docket Number | 866156 |
| Law Office Assigned | M60 |
| Employee Name | ROTH, JASON I |
Timeline
| 2000-06-28 | Application Filed |
| 2002-08-13 | Published |
| 2002-08-13 | Published for Opposition |
| 2002-11-05 | Trademark Registered |
| 2008-01-09 | Location: SCANNING ON DEMAND |
| 2009-06-13 | Cancelled |
| 2009-06-13 | Status: Dead/Cancelled |
| 2009-06-13 | Status: Registration cancelled because registrant did not file an acceptable declaration under Section 8. To view all documents in this |
| 2018-07-08 | Transaction Date |
Trademark Parties (Applicants & Owners)
| Party: |  Ebara Corporation |
| Address | 11-1, Haneda Asahi-cho Ota-ku Tokyo JAPAN |
| Legal Entity Type | Corporation |
| Legal Entity State | JAPAN |
Documents
 Application | IMAGE/TIFF | 2000-06-28 |
| Drawing | IMAGE/TIFF | 2000-06-28 |
 Registration Certificate | 2002-11-05 | |
| Registration Certificate | IMAGE/TIFF | 2002-11-05 |
| Paper Correspondence Incoming | 2006-08-21 | |
| Paper Correspondence Incoming | IMAGE/TIFF | 2006-08-21 |
| File Jacket | 2008-01-03 | |
| Unclassified | 2008-01-03 |
Attorney of Record
Good, Services, and Codes
(CANCELLED)
IC 001. US 001 005 006 010 026 046. G & S: PLATING BATH COMPOSITIONS FOR USE IN COPPER PLATING OF SEMI-CONDUCTOR WAFERS
| International Codes: | 1 |
| U.S. Codes: | 001,005,006,010,026,046 |
| Type Code | Type |
|---|---|
| GS0011 | PLATING BATH COMPOSITIONS FOR USE IN COPPER PLATING OF SEMI-CONDUCTOR WAFERS |
Trademark Filing History
| Description | Date | Proceeding Number |
|---|---|---|
| CANCELLED SEC. 8 (6-YR) | 2009-06-13 | |
| CASE FILE IN TICRS | 2008-01-09 | |
| REVIEW OF CORRESPONDENCE COMPLETE | 2006-09-18 | 74215 |
| PAPER RECEIVED | 2006-08-21 | |
| REGISTERED-PRINCIPAL REGISTER | 2002-11-05 | |
| PUBLISHED FOR OPPOSITION | 2002-08-13 | |
| NOTICE OF PUBLICATION | 2002-07-24 | |
| APPROVED FOR PUB - PRINCIPAL REGISTER | 2001-09-28 | |
| CORRESPONDENCE RECEIVED IN LAW OFFICE | 2001-05-29 | |
| NON-FINAL ACTION MAILED | 2000-11-30 | |
| ASSIGNED TO EXAMINER | 2000-11-27 | 78049 |
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