ALPHA-FRY TECHNOLOGIES

Mark For: ALPHA-FRY TECHNOLOGIES® trademark registration is intended to cover the categories of chemicals for use in the manufacture and assembly of printed circuits, electronic components and semiconductor packages; chemical compounds, namely, resin coatings used as temporary solder masks to prevent the adherence of solder to base metal for use in the printed circuit board industry; thermoplastic paste adhesives for use in the manufacture of electronic assemblies; soldering chemicals, namely, aqueous machine descalers for use in the printed circuit board industry; solder chemicals and antioxidants for use with solder; chemical preparations in the nature of rust inhibitors; soldering flux; water soluble soldering flux; low solids solder flux; soldering flux, zinc chloride type; solder chemicals and antioxidants for use with solder; fluxes used for soldering electronic circuits, which do not require cleaning after said use; oxidation chemicals for protecting the surface to which they are applied for use in connection with solder; silver/glass die attach material adhesives for use in silicon chip binding; chemical preparations for soldering, namely, soldering injection chemicals to reduce oxide formation on bridge conduction lines, surface conditioning chemicals to prepare surfaces for soldering; protective chemical coatings to maintain solderability of surfaces; ultraviolet curable polymers for use in legend inks, solder masks and etching/plating resists; soldering chemicals, namely, aqueous resist stripper for use in the printed circuit board industry. [all]

Status

2022-10-16 UTC
⟳ Refresh

DEAD REGISTRATION Cancelled Invalidated

Research	OneLook Acronym Finder
Serial Number	76057743
Registration Number	3029558
Mark Literal Elements	ALPHA-FRY TECHNOLOGIES
Mark Drawing Type	1 - TYPESET WORD(S) /LETTER(S) /NUMBER(S)
Mark Type	TRADEMARK
Standard Character Claim	No
Register	PRINCIPAL
Current Location	PUBLICATION AND ISSUE SECTION 2005-11-03
Basis	1(a)
Class Status	SECTION 8 - CANCEL
Primary US Classes	001: Raw or Partly Prepared Materials 005: Adhesives 006: Chemicals and Chemical Compositions 010: Fertilizers 026: Measuring and Scientific Appliances 046: Foods and Ingredients of Foods
Primary International Class	001 - Primary Class (Chemicals) Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
Filed Use	No
Current Use	Yes
Intent To Use	No
Filed ITU	Yes
44D Filed	No
44E Current	No
66A Current	No
Current Basis	No
No Basis	No
Cancellation Code	2
Attorney Name	William M. Borchard
Attorney Docket Number	13130-01
Law Office Assigned	M60
Employee Name	FRENCH, CURTIS W

Timeline

(CANCELLED)
IC 001. US 001 005 006 010 026 046. G & S: CHEMICALS FOR USE IN THE MANUFACTURE AND ASSEMBLY OF PRINTED CIRCUITS, ELECTRON
IC COMPONENTS AND SEMICONDUCTOR PACKAGES; CHEMICAL COMPOUNDS, NAMELY, RESIN COATINGS USED AS TEMPORARY SOLDER MASKS TO PREVENT THE ADHERENCE OF SOLDER TO BASE METAL FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; THERMOPLAST
IC PASTE ADHESIVES FOR USE IN THE MANUFACTURE OF ELECTRON
IC ASSEMBLIES; SOLDERING CHEMICALS, NAMELY, AQUEOUS MACHINE DESCALERS FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; CHEMICAL PREPARATIONS IN THE NATURE OF RUST INHIBITORS; SOLDERING FLUX; WATER SOLUBLE SOLDERING FLUX; LOW SOLIDS SOLDER FLUX; SOLDERING FLUX, ZINC CHLORIDE TYPE; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; FLUXES USED FOR SOLDERING ELECTRON
IC CIRCUITS, WHICH DO NOT REQUIRE CLEANING AFTER SAID USE; OXIDATION CHEMICALS FOR PROTECTING THE SURFACE TO WHICH THEY ARE APPLIED FOR USE IN CONNECTION WITH SOLDER; SILVER/GLASS DIE ATTACH MATERIAL ADHESIVES FOR USE IN SILICON CHIP BINDING; CHEMICAL PREPARATIONS FOR SOLDERING, NAMELY, SOLDERING INJECTION CHEMICALS TO REDUCE OXIDE FORMATION ON BRIDGE CONDUCTION LINES, SURFACE CONDITIONING CHEMICALS TO PREPARE SURFACES FOR SOLDERING; PROTECTIVE CHEMICAL COATINGS TO MAINTAIN SOLDERABILITY OF SURFACES; ULTRAVIOLET CURABLE POLYMERS FOR USE IN LEGEND INKS, SOLDER MASKS AND ETCHING/PLATING RESISTS; SOLDERING CHEMICALS, NAMELY, AQUEOUS RESIST STRIPPER FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY. FIRST USE: 19980100. FIRST USE IN COMMERCE: 19980100(CANCELLED)
IC 003. US 001 004 006 050 051 052. G & S: ORGAN
IC SOLVENTS FOR CLEANING AND DEGREASING PRINTED CIRCUIT BOARDS; SOLDERING AND PRINTED CIRCUIT CHEMICALS, NAMELY, ALKALI CLEANERS, DEGREASING SOLVENTS, FLUX REMOVER, METAL CLEANER, PAINT STRIPPERS AND VARNISH REMOVER, WIRE STRIPPING PREPARATION FOR REMOVING INSULATION FROM METAL, SILK SCREEN INK REMOVER, SOLDER RESIST REMOVING PREPARATION; SOLVENT AND AQUEOUS CLEANERS TO REMOVE RESIDUES AND CONTAMINANTS BEFORE AND AFTER SOLDERING; CHEMICAL CLEANER AND ROSIN FLUX REMOVER FOR USE IN ROSIN MILDLY ACTIVATED PASTE APPLICATIONS, NAMELY, CLEANING COMPOUND FOR SOLDER PLATED PRINTED CIRCUITS. FIRST USE: 19980100. FIRST USE IN COMMERCE: 19980100(CANCELLED)
IC 006. US 002 012 013 014 023 025 050. G & S: TIN AND LEAD EUTECT
IC SOLDER; WATER SOLUBLE ORGAN
IC FLUX CORED SOLDER WIRE; COATED METAL STRIP; SOLDERS COMPOSED PRIMARILY OF LEAD AND TIN; DISPENSER FILLED WITH WIRE SOLDER; BAR, WIRE AND CORE SOLDER; LASER CUT METAL STENCILS FOR USE IN THE ASSEMBLY OF ELECTRON
IC COMPONENTS; SOLDER METAL ALLOY THAT IS TREATED TO INHIBIT DROSS FORMATION AND INCREASE FLUIDITY FOR USE IN SOLDERING APPLICATIONS; PASTES CONTAINING METAL POWDER FOR USE IN COPPER BRAZING; FLUX CORED WIRE SOLDER FOR USE IN THE ELECTRONICS INDUSTRY. FIRST USE: 19980100. FIRST USE IN COMMERCE: 19980100